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Anti-deformation titanium target material

A titanium target, anti-deformation technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve problems such as increasing the difficulty of target production, adverse effects of sputtering effect, etc., to avoid sparking phenomenon , the effect of increasing the roughness

Inactive Publication Date: 2020-09-25
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this target requires special treatment of the titanium target, which increases the difficulty of making the target and may have adverse effects on the sputtering effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] This embodiment provides an anti-deformation titanium target, the structure of which is as follows figure 1 As shown, the target is circular, and the target includes a back plate and a sputtering part connected to the back plate, the size of the sputtering part is smaller than the size of the back plate, and the edge of the back plate is provided with There are at least two installation stepped holes, the installation stepped holes include a counterbore and a bottom hole, and the ratio of the depth of the counterbore to the depth of the bottom hole is 1.25.

[0035]The size of the back plate is 390mm, the size of the sputtering part is 320mm, the depth of the installation step hole is 9.20mm, the depth of the counterbore is 5.35mm, and the radius of the bottom hole is 4.90mm.

[0036] A sandblasting area is provided on the bottom edge of the back plate, and the roughness of the sandblasting area is 8-9 μm.

[0037] The sandblasting raw material in the sandblasting area...

Embodiment 2

[0039] This embodiment provides an anti-deformation titanium target, the structure of which is as follows figure 1 As shown, the target is circular, and the target includes a back plate and a sputtering part connected to the back plate, the size of the sputtering part is smaller than the size of the back plate, and the edge of the back plate is provided with There are at least two installation stepped holes, the installation stepped holes include a counterbore and a bottom hole, and the ratio of the depth of the counterbore to the depth of the bottom hole is 1.55.

[0040] The size of the back plate is 400mm, the size of the sputtering part is 330mm, the depth of the installation step hole is 9.50mm, the depth of the counterbore is 5.60mm, and the radius of the bottom hole is 5.30mm.

[0041] A sandblasting area is provided on the bottom edge of the back plate, and the roughness of the sandblasting area is 10-11 μm.

[0042] The sandblasting raw material in the sandblasting a...

Embodiment 3

[0044] This embodiment provides an anti-deformation titanium target, the structure of which is as follows figure 1 As shown, the target is circular, and the target includes a back plate and a sputtering part connected to the back plate, the size of the sputtering part is smaller than the size of the back plate, and the edge of the back plate is provided with There are at least two installation stepped holes, the installation stepped holes include a counterbore and a bottom hole, the ratio of the depth of the counterbore to the depth of the bottom hole is 1.35.

[0045] The size of the back plate is 392 mm, the size of the sputtering part is 323 mm, the depth of the installation step hole is 9.30 mm, the depth of the counterbore is 5.45 mm, and the radius of the bottom hole is 5.10 mm.

[0046] A sandblasting area is provided on the bottom edge of the back plate, and the roughness of the sandblasting area is 8-9 μm.

[0047] The sandblasting raw material in the sandblasting ar...

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Abstract

The invention provides an anti-deformation titanium target material. The anti-deformation titanium target material comprises a back plate and a sputtering part connected with the back plate, the sizeof the sputtering part is smaller than that of the back plate, at least two mounting stepped holes are formed in the edge of the back plate, each mounting stepped hole comprises a counter bore and a bottom hole, and the ratio of the depth of the counter bore to the depth of the bottom hole is 1.25 to 1.55. The target material is small in deformability and easy to disassemble after being used, andthe sparking phenomenon is avoided in the using process.

Description

technical field [0001] The invention belongs to the field of metal targets, and relates to a target, in particular to a deformation-resistant titanium target. Background technique [0002] Sputtering is one of the main technologies for preparing thin film materials. It uses ions generated by ion sources to accelerate and gather in a vacuum to form a high-speed energy ion beam, which bombards the solid surface, and the kinetic energy exchange occurs between the ions and the solid surface atoms. The atoms on the surface of the solid are separated from the solid and deposited on the surface of the substrate. The bombarded solid is the raw material for preparing the sputtering deposition film, which is generally called a sputtering target. [0003] Due to the different strengths of sputtering targets, in the actual application process, it is necessary to combine the sputtering targets that meet the performance requirements and the back plate with a certain strength to make a tar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34
CPCC23C14/3407
Inventor 姚力军边逸军潘杰王学泽章丽娜
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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