Laser beam perforation method, multi-stage perforation method and continuous perforation method

Abstract

The invention relates to the field of laser beam perforation, in particular to a laser beam perforation method, a multi-stage perforation method, a continuous perforation method and a laser beam perforation system. The laser beam perforation method comprises the steps that the measuring range of a capacitive sensor and current height and target height of a laser head are acquired; whether the current height and the target height are both within the measuring range or not is judged; when the judgment result is no, the laser head is moved to the target height, and then a perforation action is executed; when the judgment result is yes, tolerance is determined according to the target height, a height difference between the current height and the target height is acquired, and the height difference and the tolerance are compared; when the height difference is smaller than or equal to the tolerance, the perforation action is directly performed; and when the height difference is greater thanthe tolerance, the laser head is moved to the target height, and then the perforation action is executed. By increasing a tolerance value, on the premise that a difference value of the current heightand the target height is smaller than the tolerance, the position of the laser head does not need to be adjusted, the perforation action can be directly performed, and therefore perforation efficiencyis effectively improved.

Description

technical field [0001] The invention relates to the field of laser perforation, in particular to a laser perforation method, a multi-stage perforation method, a continuous perforation method and a laser perforation system. Background technique [0002] In the field of laser processing, materials are processed by using laser beams to interact with substances, such as cutting, welding, drilling, adding materials, surface treatment, etc. As the power of lasers in the market continues to increase, the thickness of processed profiles also increases. Perforation is an indispensable part of thick plate processing, and its perforation efficiency greatly affects the overall efficiency. [0003] When piercing a thick plate, it is necessary to move the cutting head to different process heights and shoot the laser to evaporate the material so that the gas path can be unblocked and the slag can be removed during cutting. When the plate is thinner, the perforation height is lower, and it...

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Problems solved by technology

[0007] In view of the deficiencies of the above-mentioned prior art, the object of the present invention is to provide a laser perforation method, a multi-stage perforation method, a continuous perforation method and a laser perforation system to solve the problem of low efficiency of the existing perforation method

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