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Color [mu]LED huge transfer method

A transfer method and LED chip technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems that hinder the promotion and use of μLED technology, reduce the complexity of the manufacturing process, reduce the production cycle and production cost effect

Pending Publication Date: 2020-10-13
FUZHOU UNIV +1
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AI Technical Summary

Problems solved by technology

Because μLED components are very small, and mass transfer technology requires very high efficiency, yield rate and transfer accuracy, mass transfer technology has become the biggest challenge in the development process of μLED, hindering the promotion and use of μLED technology

Method used

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  • Color [mu]LED huge transfer method
  • Color [mu]LED huge transfer method
  • Color [mu]LED huge transfer method

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Embodiment Construction

[0028] In order to further understand the characteristics and technical content of the present invention, the technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and detailed embodiments. The accompanying drawings are for reference only and are not intended to limit the present invention.

[0029] The present invention provides a method for mass transfer of colored μLEDs, which is used for simultaneous mass transfer of multiple μLED chips with different luminescent colors. The method includes the following steps:

[0030] Step S1, placing μLED chips with different luminescent colors on the transition substrate respectively, the size of the upper surface of the μLED chip on the transition substrate is smaller than the size of the lower surface;

[0031] Step S2, modifying different antibody molecules on the surface of the μLED chip with different luminous colors, that is, one kind of antibody molecule is mod...

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Abstract

The invention relates to a color [mu]LED mass transfer method. the method comprises: modifying different antibody molecules on the upper surfaces of the mu LED chips with different light emitting colors; modifying corresponding antigen molecules on a transfer transition substrate or a driving back plate, simultaneously transferring different colors of [mu]LED chips to the transfer transition substrate or the driving back plate in batches by utilizing the specificity of antigen-antibody reaction, and finally, transferring the color [mu]LED chip array on the loading plate to the corresponding driving back plate in batches to be welded and packaged. According to the method, simultaneous mass transfer of the [mu]LED chips with different light emitting colors can be accurately achieved, the transfer process is simplified, the transfer efficiency is improved, and meanwhile the production cost of the [mu]LED display screen is reduced.

Description

technical field [0001] The invention relates to the field of integrated semiconductor light emitting and display, in particular to a mass transfer method of color μLEDs. Background technique [0002] LED displays have the advantages of self-illumination, high brightness and luminous efficiency, low power consumption, high stability, etc., and are widely used in various occasions. With the reduction of LED chip size and pixel pitch, LED display is expected to realize flexible, highly transparent, interactive and modular splicing display, which is considered to be a revolutionary display technology with full functions and full application fields. μLED display is a new type of display technology composed of arrays of micron-scale LED light-emitting pixels. Major LED chip, display panel and display application manufacturers at home and abroad have actively invested in the development of ultra-high-density μLED displays. However, when the LED chip size becomes small to a certain...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683H01L27/15
CPCH01L21/67144H01L21/6835H01L27/156H01L2221/68363
Inventor 周雄图陈桂雄郭太良张永爱吴朝兴孙捷严群
Owner FUZHOU UNIV
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