Use of a resin composition in the preparation of insulating substrates or copper-clad laminates

A technology of copper-clad laminates and resin compositions, which is applied in the field of resin compositions to prepare insulating substrates or copper-clad laminates, can solve problems such as the complexity of prepolymer preparation methods, and increase the glass transition temperature without difficulty. Water absorption, efficiency improvement effect

Active Publication Date: 2022-07-22
派迈新材料(成都)有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation method of the prepolymer is relatively complicated, and a large amount of organic solvent is also used

Method used

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  • Use of a resin composition in the preparation of insulating substrates or copper-clad laminates
  • Use of a resin composition in the preparation of insulating substrates or copper-clad laminates
  • Use of a resin composition in the preparation of insulating substrates or copper-clad laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Embodiment 1, the preparation of high frequency and high speed copper clad laminate of the present invention

[0054] The dicyclopentadiene and the ruthenium carbene catalyst are blended according to the weight ratio of 10000:2, stirred and mixed evenly to obtain a glue solution, select 200*200mm E-glass fiber cloth, evenly coat the above glue solution, and cure at 60 ° C for 10 minutes , get the insulating substrate. Coat the surface of the 35-micron-thick copper foil with phenolic resin adhesive (you can also coat the phenolic resin adhesive on both sides of the insulating substrate), then place two copper foils on both sides of the insulating substrate, and place them in a vacuum hot press to press. For copper clad laminates, the temperature and time of vacuum hot pressing are 150°C for 10 minutes.

[0055] The ruthenium carbene catalyst used in this example is

Embodiment 2

[0056] Embodiment 2, the preparation of the high frequency and high speed flame retardant copper clad laminate of the present invention

[0057] Dicyclopentadiene, ruthenium carbene catalyst, silica glass microbeads, and decabromodiphenylethane are blended in a weight ratio of 10000:2:5000:1000, and the mixture is stirred and mixed to obtain a glue solution, and 200*200mm is selected. The E-glass fiber cloth was uniformly coated with the above glue solution, and cured at 60° C. for 10 minutes to obtain an insulating substrate. Coat the surface of the 35-micron-thick copper foil with phenolic resin adhesive (you can also coat the phenolic resin adhesive on both sides of the insulating substrate), then place two copper foils on both sides of the insulating substrate, and place them in a vacuum hot press to press. For copper clad laminates, the temperature and time of vacuum hot pressing are 150°C for 10 minutes.

[0058] The ruthenium carbene catalyst used in this example is ...

Embodiment 3

[0059] Embodiment 3, the preparation of the high frequency and high speed copper clad laminate of the present invention

[0060] The cycloolefin compound (composed of dicyclopentadiene and norbornene, the weight ratio of dicyclopentadiene and norbornene is 9:1), ruthenium carbene catalyst, silica glass microbeads, hexabromocyclododecane The alkane is blended according to the weight ratio of 10000:2:5000:1000, stirred and mixed evenly to obtain glue, select 200*200mm E-glass fiber cloth, evenly apply the above glue, and cure at 60 ℃ for 10 minutes to obtain insulation substrate. Coat the surface of the 35-micron-thick copper foil with phenolic resin adhesive (you can also coat the phenolic resin adhesive on both sides of the insulating substrate), then place two copper foils on both sides of the insulating substrate, and place them in a vacuum hot press to press. For copper clad laminates, the temperature and time of vacuum hot pressing are 150°C for 10 minutes.

[0061] The ...

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Abstract

The invention provides the use of a resin composition in preparing an insulating substrate or a copper-clad laminate, belonging to the field of electronic materials. The resin composition is prepared from the following raw materials by weight: 9,000-10,000 parts of a cyclic olefin compound containing one or two double bonds and at least one bridged ring, and 0.1-10 parts of a ruthenium carbene catalyst. The invention adopts the specific resin composition to prepare the insulating substrate, and the further prepared copper clad laminate can not only effectively improve the glass transition temperature of the copper clad laminate or the insulating substrate, but also can effectively reduce the dielectric loss during use and meet the application requirements of high frequency and high speed communication. At the same time, the insulating substrate or copper clad laminate prepared by the resin composition has good combustion resistance and dip soldering resistance, is not easy to absorb water, and is more suitable for preparing electronic materials. In addition, the preparation method is safe and environmentally friendly. The resin composition of the present invention prepares an insulating substrate, and the prepared copper clad laminate can be used for high-frequency and high-speed communication, especially 5G communication, and has good application prospects.

Description

technical field [0001] The invention belongs to the field of electronic materials, in particular to the use of a resin composition in preparing an insulating substrate or a copper-clad laminate. Background technique [0002] In many electronic products, printed circuit boards (PCBs) play the role of circuit interconnection and are an indispensable part of electronic products. The manufacture of printed circuit boards (PCBs) is to obtain related circuits by etching copper clad laminates (CCL, copper clad laminates for short). Copper clad laminate (CCL) refers to a plate-like material formed by dipping the reinforcing material with resin, covering one or both sides with copper foil, and hot pressing, which is the basic material for the manufacture of printed circuit boards (PCBs). . [0003] In the production of commonly used single-sided or double-sided PCBs, a series of operations (such as etching, electroplating, drilling, etc.) are performed on the copper clad board to f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F132/08C08F232/08C08F4/80B32B15/08B32B15/082B32B15/20B32B27/20B32B27/28B32B27/30
CPCC08F132/08C08F232/08C08F4/80B32B27/20B32B27/28B32B27/30B32B27/308B32B15/20B32B15/08B32B15/082B32B2307/206B32B2307/3065B32B2307/204B32B2307/73B32B2457/08
Inventor 胡革
Owner 派迈新材料(成都)有限责任公司
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