A first heat exchange plate and microchannel condenser

A technology of heat exchange plates and channels, which is applied in the field of heat exchange, can solve the problems of bulky condensers and unfavorable system integration, and achieve the effects of reducing volume, strengthening convective heat transfer intensity, and improving condensation heat transfer efficiency

Active Publication Date: 2021-11-05
WUHAN SECOND SHIP DESIGN & RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The embodiment of the present invention provides a first heat exchange plate and a microchannel condenser, which are used to solve or partially solve the problem that the existing condenser has a large volume and is not conducive to system integration

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  • A first heat exchange plate and microchannel condenser
  • A first heat exchange plate and microchannel condenser
  • A first heat exchange plate and microchannel condenser

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Embodiment Construction

[0044] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0045] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected o...

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Abstract

The invention relates to the technical field of heat exchange, and discloses a first heat exchange plate and a microchannel condenser. The first heat exchange plate is provided with a steam inlet and a water discharge port, and a plate surface of the first heat exchange plate is provided with a plurality of condensation channels, and the two ends of each condensation channel are respectively connected with the steam inlet and the water discharge port; each condensation The channels include a plurality of single-row channels connected in series and at least one multi-row channel, a multi-row channel is connected between two adjacent single-row channels, and the multi-row channels include a plurality of parallel branch channels. The condensation channel of the first heat exchange plate provided by the embodiment of the present invention includes single-row channels and multi-row channels connected in series. When the first heat exchange plate is used as a steam condensation plate, the steam will repeatedly gather and separate in the condensation channel, strengthening the The convective heat transfer intensity of the condenser is improved, and the condensation heat transfer efficiency of the condensation channel can be significantly improved, thereby relatively reducing the volume of the condenser.

Description

technical field [0001] The invention relates to the technical field of heat exchange, in particular to a first heat exchange plate and a microchannel condenser. Background technique [0002] At present, the traditional surface condenser commonly used in steam power systems includes a condensing core. The condensing core is formed by stacking steam condensing plates and cooling water plates. The steam condensing plates and cooling water plates are respectively provided with steam channels and cooling water. The channel realizes steam condensation through the convective condensation heat exchange between the steam in the steam channel and the cooling water in the cooling water channel. However, the existing condenser has the problem of large volume, which is not conducive to system integration. Contents of the invention [0003] Embodiments of the present invention provide a first heat exchange plate and a microchannel condenser, which are used to solve or partially solve th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28B1/02F28B9/08F28D9/00
CPCF28B1/02F28B9/08F28D9/0043
Inventor 魏志国林原胜柯汉兵柯志武邱志强李勇肖颀李邦明劳星胜李少丹黄崇海陈凯张克龙赵振兴王俊荣
Owner WUHAN SECOND SHIP DESIGN & RES INST
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