172 results about "Condensation heat transfer" patented technology

Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities therein extending from a first main surface towards a second main surface. The condenser block is a monolithic structure, and the first main surface is a coolant vapor condensate formation surface when the condenser structure is operationally facilitating cooling of an electronic device. The exposed cavities extend from the first main surface into the condenser block to increase a condensation surface area of the condenser block, thereby facilitating coolant vapor condensate formation on the condenser block, and thus cooling of the electronic device using a two-phase coolant. The condenser structure also includes coolant-carrying channels for facilitating cooling of the condenser block, and thus vapor condensate formation on the condenser block.

The invention discloses an internal liquid-dividing hood-type condensed heat-exchanging pipe which can improve condensed phase change heat exchanging efficiency and belongs to the technical field of forced heat transfer. The condensed heat-exchanging pipe is formed by arranging an internal liquid-dividing hood with a microporous or seam structure inside a common external heat-exchanging pipe; condensed liquid formed in the heat-exchanging process flows through the micropore or the seam and is pumped and sucked into the liquid-dividing hood in time under the action of a liquid surface tension,so that the gas phase is separated from the liquid phase; the condensed liquid flows in the internal liquid-dividing hood and is drained out of the heat-exchanging pipe through the internal liquid-dividing hood; and steam is kept to flow in a clearance between the external heat-exchanging pipe and the internal liquid-dividing hood, so that the inner wall of the external heat-exchanging pipe contacts the steam to the maximum extent and a thin liquid film is formed on the inner wall surface of the external heat-exchanging pipe, and thus the condensed heat-exchanging coefficient is improved. Thetechnical problem that the heat transfer is deteriorated because a thick liquid film is formed in the direction of the pipe length in the condensed heat transfer process is fundamentally overcome; the internal liquid-dividing hood-type condensed heat-exchanging pipe is not affected by weight, so that the condensed heat transfer coefficient can be obviously improved on the ground and in a microgravity environment.