How to make a thin uniform temperature plate
A production method and technology of vapor chambers, which are applied to semiconductor/solid-state device parts, lighting and heating equipment, indirect heat exchangers, etc., can solve the problems of long production cycle, environmental protection, and high production cost, and achieve saving production Cost and man-hour saving effect
Active Publication Date: 2021-08-24
GUANGZHOU NEOGENE THERMAL MANAGEMENT TECH CO LTD
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Problems solved by technology
However, the production cost of the etching process is expensive and the waste chemical liquid produced by it also has environmental problems, which makes the cost of the produced vapor chamber components high and the production cycle is long
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[0040] In order to make the advantages, spirit and characteristics of the present invention more easily and clearly understood, the following will be described and discussed in detail with reference to the accompanying drawings. It should be noted that these embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding embodiments.
[0041] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "longitudinal, horizontal, up, down, front, back, left, right, top, bottom, inside, outside" are based on the drawings. The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifies the description, but does not indicate that the device or element must have a specific orientat...
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A method for manufacturing a thin vapor chamber, comprising the following steps: providing a first metal sheet and a second metal sheet; providing a first metal paste and a second metal paste; circularly laying the first metal paste on A slurry wall is formed on the first metal sheet, and a groove is formed inside the slurry wall; the slurry wall is heated to form a dense structure wall; the second metal slurry is laid in the groove; the second metal slurry is heated to forming a porous capillary structure; airtightly welding the surface of the dense structure wall of the second metal sheet and the first metal sheet to form a cavity; processing the cavity to form a thin uniform temperature plate. This method manufactures grooves and capillary structures with an additive manufacturing process, replacing the etching process and copper mesh laying and sintering process in the prior art.
Description
technical field [0001] The invention provides a method for manufacturing a thin vapor chamber, especially a method for manufacturing a thin vapor chamber by adding materials to reduce manufacturing costs. Background technique [0002] With the rapid development of science and technology, the shape demands of all electronic devices are gradually moving towards light, thin and small designs, especially thin notebook PCs (Notebook PCs) and smart phones (Smartphones) used for mobile computing (Mobile Computing) and mobile communication , smart glasses (Smartglasses) and so on. However, in order to reduce the thickness of the electronic communication device, the most common problem is heat dissipation and thermal management. Because in thinner devices, the space where heat dissipation components can be placed will be compressed. Vapor Chambers or Micro Heat Pipes generally used in traditional desktop computers and notebook computers, it is difficult for the thickness of the com...
Claims
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IPC IPC(8): B22F3/22B22F3/11B22F1/00B22F7/08F28D15/04B22F1/065B22F1/068B22F1/107
CPCB22F3/22B22F3/1021B22F3/1121B22F7/08F28D15/046B22F1/065B22F1/068B22F1/107B22F1/00F28D15/04B22F3/11H01L23/427
Inventor 陈振贤
Owner GUANGZHOU NEOGENE THERMAL MANAGEMENT TECH CO LTD