Manufacturing process of two-step plate

Abstract

The invention discloses a manufacturing process of a two-step plate. The manufacturing process comprises the following steps: inner-layer circuits of a first core plate and a second core plate are respectively manufactured, wherein the inner layer circuit on the first core plate comprises bonding pads which are correspondingly arranged on two sides of the stepped groove area; a blind groove is milled in the periphery, corresponding to the stepped groove area, of the second core plate; the first core plate, first non-gummosis PP, second non-gummosis PP and the second core plate are laminated insequence and then pressed into a production plate, a first window and a second window which are larger than the maximum size of the stepped groove area are formed in the first non-gummosis PP and thesecond non-gummosis PP, and the size of the first window is larger than that of the second window; an outer layer circuit and a solder mask layer are sequentially manufactured on the production board; the part, corresponding to the stepped groove area, of the second core plate is removed to form a first groove hole and expose the bonding pad; and a second slotted hole is formed in the middle of the bottom of the first groove hole. According to the manufacturing process disclosed by the invention, the problem of abnormal quality caused by an inner-layer PAD on gummosis is effectively solved ina double-layer PP unequal-size windowing manner.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a manufacturing process of a twice-stepped board. Background technique [0002] With the development of electronic product technology and the demand for multi-functionality, stepped PCBs have emerged as the times require. Device security and meeting the high-speed and high-information requirements of communication products. [0003] In the existing step board, there are two steps with different sizes at the step position, and when the inner PAD (pad) at the bottom of the step needs to be immersed in gold, the requirement for the amount of glue flow at the step position is relatively high, but when making the step board In the existing process, there is an abnormal quality of the PAD on the overflow glue, which leads to the inability of the PAD to be plated with a gold layer during the later immersion gold treatment. Contents of the invention [00...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the above-mentioned existing technical defects, the present invention provides a manufacturing process for twice-stepped slabs. This method uses two sheets of non-flowing PP for lamination, and uses double-layer PP with unequal large windows to ensure lamination. Reduce the amount of glue flow while maintaining the quality, which can effectively solve the problem of abnormal quality caused by the inner PAD on the glue flow