A kind of copper etching accelerator and etching potion of sulfuric acid hydrogen peroxide system

Abstract

The invention provides a copper etching accelerator of sulfuric acid hydrogen peroxide system, which is composed of peptide, alcohol and carboxylic acid according to the weight ratio of peptide: alcohol: carboxylic acid=10-2500:1-500:1-2000. The peptide and copper ions form a complex, which can effectively reduce the concentration of copper ions that catalyze the decomposition of hydrogen peroxide in the sulfuric acid hydrogen peroxide system; the polar groups in the peptide also form hydrogen bonds with hydrogen peroxide to prevent the hydrogen peroxide from being decomposed by other components, so as to protect the hydrogen peroxide. Purpose. Alcohol can effectively make the etching potion fully contact and wet the copper surface, assist the initial reaction of the etching potion, make the etching potion evenly etch the copper surface, and ensure the uniform color of the copper surface after etching. The copper etching accelerator can also shield chloride ions, avoid the formation of chlorine dissolved in the etching liquid, and block the reaction between chlorine and hydrogen peroxide, thereby solving the problem of the reduction of the etching rate caused by the reaction of hydrogen peroxide and chlorine. The copper etching accelerator can expand the chloride ion concentration control range from 2-5ppm to 2-10ppm, which greatly reduces the difficulty of chloride ion concentration control.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a copper etching accelerator and an etching solution of a sulfuric acid hydrogen peroxide system. Background technique [0002] In recent years, with the rapid development of fine lines, there has been a greater demand for the production of fine lines of 0.05mm and below, and the control of copper surface roughness has attracted more and more attention. As a key factor in circuit fabrication, chemical etching has a direct impact on the roughness of the copper surface. Micro-etching is a kind of etching. Common chemical micro-etching includes sulfuric acid-hydrogen peroxide, sulfuric acid-persulfate, hydrochloric acid-chlorate, etc. The basic principle is to use hydrogen peroxide, chlorate, persulfate, etc. in an acidic environment. Strong oxidizing property, redox reaction occurs with the copper surface, and sulfuric acid reacts with the oxides of the copper sur...

AI Technical Summary

Problems solved by technology

At present, the biggest problem of this etching system on the market is how to solve the chlorine resistance of the potion and reduce the negative impact of chloride ions on the potion, because the presence of a small amount of chloride ions will greatly reduce the etching rate

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