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PCIE golden finger and design method thereof

A golden finger and preset value technology, applied in CAD circuit design, instrument, electrical connection formation of printed components, etc., can solve the problem of signal reflection, high frequency point resonance, etc.

Active Publication Date: 2020-11-03
SHANGHAI EMBEDWAY INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above technical problems, this application provides a PCIE gold finger and its design method to solve the problem of signal reflection and resonance at high frequency points that occur during the use of the existing PCIE gold finger

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  • PCIE golden finger and design method thereof

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Embodiment Construction

[0041] As mentioned in the background technology, due to the standard PCIE gold finger package pad size in the prior art, the differential impedance of the gold finger area is low, which will cause reflections. In addition, the short distance between the gold finger and the PIN pin contact point The stub will cause the resonance of the high frequency point, and also cause a relatively large reflection, so that the energy of the signal transmission is lost.

[0042] In general, refer to figure 1 , the width of pad 1 of the PCIE golden finger package is 0.7 mm, the length of pad 1 is 4.0 mm, and the distance between two pads 1 is 0.3 mm. At this time, according to these size parameters, it can be calculated that the impedance of a single pad 1 is 38ohm, which is much lower than the PCIE trace impedance of 85ohm, and the reflection parameter (=(85-38) / (85+38)≈0.382) is relatively large, The reflection of the transmitted signal is relatively serious, which adversely affects the s...

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Abstract

The invention discloses a PCIE golden finger and a design method thereof, and the widths of a first bonding pad and a second bonding pad in a differential line of the PCIE golden finger are smaller than a first preset value and larger than a second preset value, so as to reduce the difference between the impedance of the first bonding pad and the impedance of a PCIE wire. The difference value between the impedance of the second bonding pad and the impedance of the PCIE wire is reduced. Besides, the lengths of the first bonding pad and the second bonding pad are smaller than a third preset value, so that the resonant frequencies of the contact points of the first bonding pad, the second bonding pad and the connector terminal are within a preset frequency range, and the preset frequency range is the typical bandwidth of a PCIE signal; the problem that resonance is generated with a high-frequency point of a high-speed signal in the signal transmission process is solved, and complete transmission of the high-speed signal can be guaranteed while the contact reliability is met.

Description

technical field [0001] The present application relates to the technical field of integrated circuits, and more specifically, to a PCIE golden finger and a design method thereof. Background technique [0002] Some hardware on the motherboard of the computer and server, such as the DDR slot on the memory stick and the memory, the PCIE slot of the graphics card and the graphics card, etc., these signals are transmitted through the golden finger. Gold fingers are composed of many golden-yellow conductive contacts. Because the surface is gold-plated and the conductive contacts are arranged like fingers, they are called "gold fingers". The gold fingers are paired with the corresponding slot connectors, which solves the cross-board mechanical and electrical connection between the main board and the module. [0003] PCIE, or PCI-Express (Peripheral Component Interconnect Express, high-speed serial computer expansion bus standard) is a high-speed serial computer expansion bus standa...

Claims

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Application Information

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IPC IPC(8): G06F13/40G06F13/42H05K1/11H05K3/40H05K3/42G06F30/39
CPCG06F13/409G06F13/4282H05K1/117H05K3/403H05K3/42H05K1/116G06F30/39G06F2213/0026H05K2201/09427
Inventor 羊杨
Owner SHANGHAI EMBEDWAY INFORMATION TECH