PCIE golden finger and design method thereof
A golden finger and preset value technology, applied in CAD circuit design, instrument, electrical connection formation of printed components, etc., can solve the problem of signal reflection, high frequency point resonance, etc.
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[0041] As mentioned in the background technology, due to the standard PCIE gold finger package pad size in the prior art, the differential impedance of the gold finger area is low, which will cause reflections. In addition, the short distance between the gold finger and the PIN pin contact point The stub will cause the resonance of the high frequency point, and also cause a relatively large reflection, so that the energy of the signal transmission is lost.
[0042] In general, refer to figure 1 , the width of pad 1 of the PCIE golden finger package is 0.7 mm, the length of pad 1 is 4.0 mm, and the distance between two pads 1 is 0.3 mm. At this time, according to these size parameters, it can be calculated that the impedance of a single pad 1 is 38ohm, which is much lower than the PCIE trace impedance of 85ohm, and the reflection parameter (=(85-38) / (85+38)≈0.382) is relatively large, The reflection of the transmitted signal is relatively serious, which adversely affects the s...
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