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Gold plating device and gold plating method

A solution tank and water pump technology, applied in the direction of cells, electrolysis process, electrolysis components, etc., can solve the problems of inability to gold plating, insufficient gold plating, etc.

Inactive Publication Date: 2020-11-06
首顾表面处理(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a gold plating method, which aims to solve the insufficient gold plating caused by the part of the object to be plated in direct contact with the filter box (or box) in the existing chemical gold plating device, so that this part cannot be fully contacted with the gold plating solution or the problem of not being able to gild

Method used

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  • Gold plating device and gold plating method
  • Gold plating device and gold plating method
  • Gold plating device and gold plating method

Examples

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Effect test

Embodiment 1

[0033] This embodiment provides a gold plating device, as attached figure 1 shown, including:

[0034] One side of the housing 1 is provided with a feed port 13 .

[0035] The hydraulic machine 15 that is arranged on the casing 1 top.

[0036] The filter box 14 arranged at the output end of the hydraulic machine 15 .

[0037] A solution tank 12 arranged at the bottom of the casing 1 .

[0038] The water pump 7 arranged outside the housing 1, the water inlet of the water pump 7 is connected to the solution tank 12 through a first water inlet pipe 4, and the water outlet of the water pump 7 is connected to the bottom of the solution tank 12 through a first water outlet pipe 10.

[0039] Specifically, the hydraulic press 15 and the solution tank 12 are both arranged on the inner wall of the housing 1 .

[0040] Specifically, the housing 1 has a rectangular structure, of course, it can also be a square structure, an oval structure, etc. according to actual needs.

[0041] Spe...

Embodiment 2

[0071] This embodiment provides another gold plating device, as attached image 3 As shown, it includes: a housing 1 with a feed inlet 13 on one side, a bracket 22 arranged outside the housing 1, a belt conveying mechanism 23 arranged on the bracket 22, and a driving motor arranged on the top of one side of the housing 1 16. The threaded rod 21 connected to the output end of the drive motor 16, the support rod 20 threaded through the threaded rod 21 and threaded with the threaded rod 21, the fixed plate 19 connected with the support rod 20, the fixed plate 19 Camera 18, the hydraulic press 15 arranged on the fixed plate 19, the mechanical claw 17 arranged at the output end of the hydraulic press 15, the filter box 14 grabbed by the mechanical claw 17, the solution tank 12 arranged at the bottom of the housing 1, and the Outer water pump7.

[0072] Wherein, the other end of the threaded rod 21 is rotatably connected to the bracket 22, the water inlet of the water pump 7 is con...

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Abstract

The embodiment of the invention is suitable for the technical field of chemical gold plating, and provides a gold plating device and a gold plating method. The gold plating device comprises a shell which is provided with a feeding port at one side, a hydraulic machine arranged at a top part of the shell, a filtering box arranged at an output end of the hydraulic machine, a solution box arranged ata bottom part of the shell, a water pump arranged at outside of the shell, a water inlet of the water pump is connected into the solution box through a first water feeding pipe, and a water outlet ofthe water pump is connected into the bottom part of the solution box through a first water discharge pipe. With the device and the method provided by the embodiment of the invention, a position of ato-be-plated object can be adjusted in real time through an impact force formed by jetting of the first water discharge pipe or fluidity of gold plating liquid, an occasion that a part of the to-be-plated object is always in direct contact with the filtering box can be avoided, thus, each part of the to-be-plated object can fully contact the gold plating liquid, and a completely plated to-be-plated object can be obtained after gold plating is completed.

Description

technical field [0001] The invention belongs to the technical field of chemical gold plating, and in particular relates to a gold plating device and method. Background technique [0002] Gold plating is a decorative process that refers to a thin layer of gold on the surface of the object to be plated. It is mainly divided into chemical gold plating and electroplating gold. Electroless gold plating is to place the object to be plated in the configured gold plating solution for immersion. A layer of gold is plated on the surface of the object to be plated, while electroplating uses the principle of electrolysis to plate a layer of gold on the surface of the object to be plated. The difference between the two is that one needs to be connected to an electrical appliance and the other does not need to be connected to an electrical appliance. shortcoming. [0003] The chemical gold plating device generally includes a shell, a box body, a telescopic structure and a filter box. Whe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D21/14C25D21/06C25D3/48
CPCC25D17/00C25D21/14C25D21/06C25D3/48
Inventor 闻峰许清豪陈凯珊
Owner 首顾表面处理(深圳)有限公司
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