Epoxy resin composite board and preparation method thereof
A technology of epoxy resin and composite board, applied in the field of epoxy resin, which can solve the problems of poor scratch resistance and temperature resistance of the surface of epoxy resin board, easy sedimentation of quartz stone particles, uneven dispersion of product particles, etc. , to achieve the effect that the board is tight, not easy to warp and deform, and the texture is improved
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Embodiment 1
[0027] An epoxy resin composite board, comprising the following materials in parts by weight:
[0028] 24 parts of epoxy resin, 5.5 parts of diethylenetriamine, 62 parts of silicon powder, 7 parts of graphene, 0.2 parts of color paste, 0.2 parts of flame retardant additive, 0.1 part of silane coupling agent UP-560, quartz particles 1 part, the particle size of silica powder is 400 mesh, and the particle size of quartz particles is 100-200 mesh.
[0029] The preparation method of above-mentioned epoxy resin composite board, comprises the steps:
[0030] (1) Heating the epoxy resin to 100°C, adding the graphene into the epoxy resin at a speed of 60g / min, and stirring at a high speed in the dispersing kettle so that the graphene is evenly dispersed into the epoxy resin; Ethylenetriamine and silica powder are preheated to 60°C;
[0031] (2) Put the epoxy resin dispersed with graphene, diethylenetriamine, and color paste into the reaction kettle, keep the temperature in the react...
Embodiment 2
[0037] An epoxy resin composite board, comprising the following materials in parts by weight:
[0038] 20 parts of epoxy resin, 4 parts of diethylenetriamine, 70 parts of silicon micropowder, 6 parts of graphene, 0.2 part of color paste, 0.1 part of flame retardant additive, 0.08 part of silane coupling agent UP-560, quartz particles 0.8 parts, the particle size of silicon micropowder is 300 mesh, and the particle size of quartz particles is 200-250 mesh.
[0039] The preparation method of above-mentioned epoxy resin composite board, comprises the steps:
[0040] (1) Epoxy resin is heated to 80 ℃, graphene is added in the epoxy resin with the speed of 65g / min, and high-speed stirring in the dispersing tank, graphene is evenly dispersed in the epoxy resin; Ethylenetriamine and silicon micropowder are preheated to 50°C;
[0041] (2) Put the epoxy resin dispersed with graphene, diethylenetriamine, and color paste into the reaction kettle, keep the temperature in the reaction ke...
Embodiment 3
[0047] An epoxy resin composite board, comprising the following materials in parts by weight:
[0048] 30 parts of epoxy resin, 8 parts of diethylenetriamine, 65 parts of silicon micropowder, 5 parts of graphene, 0.3 parts of color paste, 0.3 parts of flame retardant additive, 0.2 parts of silane coupling agent UP-560, quartz particles 2 parts, the particle size of the silicon micropowder is 500 mesh, and the quartz particles are formed by mixing quartz particles with a particle size of 50-150 mesh and quartz particles with a particle size of 150-250 mesh at a weight ratio of 1:1.
[0049] The preparation method of above-mentioned epoxy resin composite board, comprises the steps:
[0050] (1) Heating the epoxy resin to 120°C, adding graphene into the epoxy resin at a speed of 70g / min, and stirring at a high speed in the dispersing tank, so that the graphene is evenly dispersed in the epoxy resin; Ethylenetriamine and silica powder are preheated to 65°C;
[0051] (2) Put the ...
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