Control method and control system for cutting crystal bar by diamond wire

Abstract

The invention provides a control method and control system for cutting a crystal bar by a diamond wire. The diamond wire is arranged between two cutting main rollers with the same size and the same height, and the crystal bar is positioned on a central axis between the two cutting main rollers to cut in the direction perpendicular to a connecting line between the two cutting main rollers. The control method comprises the steps that whether an actual wire arch when the diamond wire cuts the crystal bar meets a backoff condition is judged, if so, the crystal bar or the diamond wire is retracteda first distance and then cutting continues, if not, no changes are made, that is, as long as the retreating condition is satisfied, the crystal bar or the diamond wire retreats the first distance, aslong as the retreating condition is satisfied, the crystal bar or the diamond wire retreats the first distance, so that the repetition can ensure that the actual contact surface of the diamond wire and the crystal bar is always at a distance around the arc top of the wire arch, the situation that the diamond wire and the crystal bar are cut by the a small wire arch is maintained more, the good cutting lubrication and cooling effect is achieved, and therefore, the better cutting surface quality is obtained.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a control method and a control system for diamond wire cutting crystal rods. Background technique [0002] The traditional diamond wire cutting ingot adopts the high-speed rotation of the wire net, and the Z-axis of the ingot is fed downward to achieve cutting. During the cutting process, as the cutting depth increases, since the ingot is bonded along the direction of the fixture plate, And perpendicular to the wire network, during the cutting process, the contact surface between the diamond wire and the ingot material will gradually increase from zero to the maximum at the diameter of the ingot, and then gradually decrease until the ingot is completely cut. As the contact surface between the diamond wire and the ingot increases, the cutting resistance increases, and the wire bow produced by the diamond wire will also increase accordingly, and the quality of cutting lubr...

AI Technical Summary

Problems solved by technology

As the contact surface between the diamond wire and the ingot increases, the cutting resistance increases, and the wire bow produced by the diamond wire will also increase accordingly, and the quality of cutting lubrication and cooling will decrease, resulting in cutting lines with different arc lengths on the cutting surface, which will affect the wafer. Surface Quality

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