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A kind of halogen-free solder paste and preparation method thereof

A halogen and solder paste technology, applied in the field of halogen-free solder paste and its preparation, can solve the problems of uneven distribution, poor refinement of alloy solder powder, low elongation of alloy solder powder, etc., to achieve strong market competitiveness, solder The effect of less residue and low cost

Active Publication Date: 2022-05-13
HUIZHOU YUAN DE ZHI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the alloy solder powder of this solder paste has a poor degree of refinement, uneven distribution, low elongation of the alloy solder powder, and poor mechanical properties of the solder paste.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of halogen-free solder paste of the present invention consists of 85 parts by weight of Sn-X alloy powder, 1 part by weight of halogen-free activator, 3 parts by weight of organic solvent, 4 parts by weight of liquid rosin resin, 0.75 parts by weight It is prepared by mixing thixotropic agent in parts by weight and leveling agent in 0.2 parts by weight.

[0023] Wherein, the weight of the above-mentioned Sn-X alloy powder is 100wt%, and the weight of the X element is 1wt%.

[0024] Wherein, the element X in the above-mentioned Sn—X alloy powder is silver element.

[0025] Wherein, the above-mentioned halogen-free activator is acetic acid.

[0026] Wherein, the above-mentioned organic solvent is Alcohol Twelve.

[0027] Wherein, the density of above-mentioned liquid rosin resin is 1.05 / cm 2 , the solid content of the liquid rosin resin is 49wt%, and the pH value is 5.5.

[0028] Wherein, the thixotropic agent is fumed silica.

[0029] Wherein, the leveling ag...

Embodiment 2

[0036] A kind of halogen-free solder paste of the present invention consists of 90 parts by weight of Sn-X alloy powder, 1.5 parts by weight of halogen-free activator, 4 parts by weight of organic solvent, 5 parts by weight of liquid rosin resin, 1 It is prepared by mixing thixotropic agent in parts by weight and leveling agent in 0.5 parts by weight.

[0037] Wherein, the weight of the above-mentioned Sn-X alloy powder is 100wt%, and the weight of the X element is 2wt%.

[0038] Wherein, the element X in the above-mentioned Sn-X alloy powder is bismuth element.

[0039] Wherein, the above-mentioned halogen-free activator is lactic acid.

[0040] Wherein, the above-mentioned organic solvent is terpineol.

[0041] Wherein, the density of above-mentioned liquid rosin resin is 1g / cm 2 , the solid content of the liquid rosin resin is 48wt%, and the pH value is 4.5.

[0042] Wherein, the thixotropic agent is clay particles.

[0043] Wherein, the leveling agent is an alkyl modi...

Embodiment 3

[0050] A kind of halogen-free solder paste of the present invention consists of 80 parts by weight of Sn-X alloy powder, 0.5 parts by weight of halogen-free activator, 2 parts by weight of organic solvent, 3 parts by weight of liquid rosin resin, 0.5 parts by weight of It is prepared by mixing thixotropic agent in parts by weight and leveling agent in 0.05 parts by weight.

[0051] Wherein, the weight of the above-mentioned Sn-X alloy powder is 100wt%, and the weight of the X element is 0.1wt%.

[0052] Wherein, the element X in the above Sn-X alloy powder is aluminum element.

[0053] Wherein, the above-mentioned halogen-free activator is pyruvic acid.

[0054]Wherein, the above-mentioned organic solvent is tributyl citrate.

[0055] Wherein, the density of above-mentioned liquid rosin resin is 1g / cm 2 , the solid content of the liquid rosin resin is 48wt%, and the pH value is 4.5.

[0056] Wherein, the thixotropic agent is gas phase lauryl hydroxystearic acid.

[0057] ...

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Abstract

The invention belongs to the technical field of solder paste and its preparation, and provides a halogen-free solder paste and a preparation method thereof. The halogen-free solder paste comprises 80-90 parts by weight of Sn-X alloy powder, 0.5-1.5 parts by weight of halogen-free activated agent, 2-4 parts by weight of organic solvent, 3-5 parts by weight of liquid rosin resin, 0.5-1 parts by weight of thixotropic agent and 0.05-0.5 parts by weight of leveling agent, which solves the problem of solderability after halogen butt welding The impact caused by welding has less residue after welding, no cleaning, environmental protection and non-toxicity, low cost, and strong market competitiveness. The invention has good adhesion between the halogen-free solder paste and the soldering substrate, and can effectively solve the problem of poor soldering performance of the conventional solder paste.

Description

technical field [0001] The invention belongs to the technical field of solder paste and its preparation, and in particular relates to a halogen-free solder paste and a preparation method thereof. Background technique [0002] Solder paste is a new type of soldering material that came into being along with SMT. Solder paste is a complex system, a paste made of tin powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the components to be soldered and the printed circuit pads are welded together to form a solder paste. Permanent connection. [0003] Chinese patent application CN101143407A discloses a solder paste and its preparation method, the solder paste components and the weight percentage content of each component are; alloy solder powder 80-90%; organic solvent 6-8%; orga...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/262B23K35/3612B23K35/025
Inventor 梁宏平欧阳亮郑富东
Owner HUIZHOU YUAN DE ZHI TECH CO LTD