A process for solving the delamination problem during graphene processing
A graphene and problem technology, applied in the field of graphene die-cutting, can solve the problems of easy misalignment of light films, easy delamination of heavy films, and large gap between products and products, so as to reduce peeling force, ensure quality, and reduce fractions. layer rate effect
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[0017] A process to solve the problem of layering during graphene processing, see Figure 1 、 Figure 2 : The graphene 1 self-adhesive film 2 will be peeled off in advance before die cutting, and then the back surface of the graphene 1 will be compounded with a release film 3 of the double-sided adhesive layer 3, the upper surface of the double-sided adhesive layer 3 will be bonded to the back of graphene 1, and then the graphene 1 with the release film 4 will be bonded by the double-sided adhesive layer 3 by the knife die, and the gap area between the adjacent two sets of products 5 of different pieces is cut into the filling middle area by the knife die, and the filling intermediate area and its spaced adjacent product 5 are not connected to each other.
[0018] The viscosity of the double-sided adhesive layer 3 is 500g / inch~1000g / inch;
[0019] The double-sided adhesive layer 3 is specifically an organic material silicone layer, and the specific thickness of the double-sided adhe...
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