A process for solving the delamination problem during graphene processing

A graphene and problem technology, applied in the field of graphene die-cutting, can solve the problems of easy misalignment of light films, easy delamination of heavy films, and large gap between products and products, so as to reduce peeling force, ensure quality, and reduce fractions. layer rate effect

Active Publication Date: 2022-06-07
SUZHOU ANJIE TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. At present, there are restrictions on the die-cutting process film and the shipping film.
[0004] 2. Since the raw material of graphene is flakes, the gap between the product and the product is relatively large, which causes the air wrapped around the edge to be squeezed into the product.

Method used

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  • A process for solving the delamination problem during graphene processing
  • A process for solving the delamination problem during graphene processing

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Embodiment Construction

[0017] A process to solve the problem of layering during graphene processing, see Figure 1 、 Figure 2 : The graphene 1 self-adhesive film 2 will be peeled off in advance before die cutting, and then the back surface of the graphene 1 will be compounded with a release film 3 of the double-sided adhesive layer 3, the upper surface of the double-sided adhesive layer 3 will be bonded to the back of graphene 1, and then the graphene 1 with the release film 4 will be bonded by the double-sided adhesive layer 3 by the knife die, and the gap area between the adjacent two sets of products 5 of different pieces is cut into the filling middle area by the knife die, and the filling intermediate area and its spaced adjacent product 5 are not connected to each other.

[0018] The viscosity of the double-sided adhesive layer 3 is 500g / inch~1000g / inch;

[0019] The double-sided adhesive layer 3 is specifically an organic material silicone layer, and the specific thickness of the double-sided adhe...

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Abstract

The invention provides a process for solving the delamination problem during graphene processing, which reduces the delamination rate of the die-cut product and ensures the quality of the product. It peels off the graphene self-contained film in advance before die-cutting, and then composites a release film with a double-sided adhesive layer on the back of the graphene. The upper surface of the double-sided adhesive layer is bonded to the back of the graphene. The graphene bonded with the release film on the double-sided adhesive layer is cut off by a knife die, and the gap area between two adjacent groups of products of different sheets is cut into a filled middle area by a knife die, and the filled middle area and its Interval adjacent products are not connected to each other.

Description

Technical field [0001] The present invention relates to the technical field of graphene die-cutting processing, specifically a process to solve the problem of layering when graphene processing. Background [0002] Graphene due to raw material restrictions, the current manufacturers in the production can not effectively control the quality of incoming materials, graphene through the laminated powder pressing to form a graphene material with a certain thickness, graphene material in the production process did not add any binder, so there is a risk of delamination, resulting in processing products easy to delaminate, after research found that graphene causes delamination reasons in addition to the material itself factors have the following points: [0003] 1 At present, there are restrictions on the die-cutting and matching process film and the shipping film, a. the light film is easy to be offset; b. the heavy film is easy to delaminate; [0004] 2. Graphene is made of flakes due t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26F1/38C01B32/194
CPCB26F1/38C01B32/194
Inventor 王春生王成朱礼章
Owner SUZHOU ANJIE TECH
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