34results about How to "Reduce the chance of delamination" patented technology

The invention provides a multielement silane coupling agent-modified phenolic resin base combined disc brake pad and a preparation method thereof, and relates to the technical field of automobile parts.The brake pad is prepared from, by mass, 4-7% of organosilicone-modified phenolic resin, 2-4% of polyacrylonitrile carbon fibers, 2-4% of aramid pulp, 10-34% of potassium titanate lamellae, 5-18% of steel fibers, 2-6% of glass fibers, 3-10% of natural flake graphite, 3-10% of granulated coke, 0.5-1.5% of silicon dioxide, 25-40% of barite and 2.5-10% of a multielement silane coupling agent.The disc brake pad has the advantages of being good in interfacial compatibility, stable in friction coefficient and product quality, excellent in wear resistance and anti-noise performance and the like; besides, a material modification process and a mixing process are integrated in the preparation method of the disc brake pad, so that production efficiency is high, modification cost is lowered, and the process is simple.

The invention discloses a multi-layer framework reinforced plastic composite pipe which comprises a pipe body formed through the extrusion molding technology, wherein at least two layers of reinforcedframeworks are fixed between the inner wall and the outer wall of the pipe body through the extrusion molding technology and comprise at least one of a reinforced framework A or a reinforced framework B; the reinforced framework A comprises a plurality of longitude lines arranged in the circumferential direction of the pipe body; the longitude lines extend in the axial direction of the pipe body,are spirally wound through latitude lines in the axial direction of the pipe body, and are fixed through welding; the longitude lines and the latitude lines are steel wires; and the reinforced framework B is a continuous integrated grid structure. The multi-layer framework reinforced plastic composite pipe can improve the pipe loading capacity and organically combines high rigidity of steel withnon-corrosibility of plastic; the pipe with relative smaller wall thickness can meet the pressure using requirement, and the excellent characteristics of the plastic pipe are also kept. The multi-layer framework reinforced plastic composite pipe is suitable for the technical field of performance reinforcement of the composite pipe during the production process of plastics-steel composite pipes.

The invention relates to the field of special plywood applied to the vehicle bottom plate environment which is frequently vibrated and bended, in particular to bending-resisting plywood. The bending-resisting plywood comprises a pressed sawdust layer, a first plate layer and a second plate layer, wherein the first plate layer and the second plate layer are glued on the two sides of the sawdust layer. A metal mesh layer is embedded in the middle of the sawdust layer; and at least two woven mesh layers are symmetrically arranged on the two sides of the metal mesh layer and embedded in the sawdust layer. The thickness of the sawdust layer in the three layers of plates of the structure is convenient to control, the metal mesh layer and the woven mesh layers are arranged in an embedded mode, the metal mesh layer serves as a framework, and the woven mesh layers are arranged on the two sides of the metal mesh layer, so that the integrity of the sawdust layer is improved, the metal mesh layer or the woven mesh layers are prevented from delaminating, saw dust is fully utilized, and the manufacturing cost is reduced by 10%-20% compared with the same kind of plywood.

The invention discloses a method for manufacturing an aluminum foil sealing film and belongs to the technical field of sealing film packaging. The method sequentially includes the processes of 1, composting, wherein one face of aluminum foil is coated with a bonding agent, a thermoplastic resin film is composted to the face, with the bonding agent, of the aluminum foil after the aluminum foil is dried, and a composite film is formed; 2, first curing, wherein the composite film is placed in a curing chamber to be cured; 3, warehousing, wherein the cured composite film is stored into a warehouse; 4, printing, wherein when printing is needed, the composite film is taken out from the warehouse, the non-composite face of the aluminum foil of the composite film is printed with selected characters or patterns with oil ink, and drying treatment is conducted; 5, varnishing, wherein the face printed with oil ink of the aluminum foil is coated with varnish; 6, splitting, the varnished composite film is split to be of the required size; and 7, packaging, wherein split composite films are packaged. By means of the method, the technical problems that an existing method for manufacturing an aluminum foil sealing film is long in manufacturing cycle, and the manufactured aluminum foil sealing film is high in layering rate are solved. The method has the beneficial effects of being short in manufacturing cycle, and the manufactured aluminum foil sealing film is low in layering rate.

The invention discloses a multichip stacking structure and a method for manufacturing the same. The multichip stacking structure comprises a first chip set which is provided with a plurality of first chips and is connected with a chip bearing piece in a stepped mode; the first chip of the topmost layer of the first chip set is connected with a second chip so that the first chip and the second chip are in electric connection with the chip bearing piece through a welding wire; adhesive film over wire technology (Film over Wire, FOW) is utilized to stack a third chip alternated with an insulating adhesive film on the first chip and the second chip so that the insulating adhesive film covers part of the welding wire end of the first chip of the topmost layer of the first chip set and at least one part of the second chip and is in electric connection with the third chip and the chip bearing piece through the welding wire, thereby solving the problem that when the second chip with planar dimension far less than that of the first chip is directly stacked on the first chip in the prior art, the height of the whole structure and the difficulty of wire welding operation are increased.

The invention discloses a lemon-flavored emulsifying essence and a preparation process thereof. Productive raw materials of the emulsifying essence comprises a lemon-flavored essence, a weighting agent, an antioxidant, an emulsifying agent, deionized water, thickening agent and a compound preservative. The lemon-flavored essence comprises lemon oil, white lemon oil, natural linalool, natural capraldehyde, Sunkist sweet orange oil, geranium oil, natural terpineol and salad oil. A production process comprises the following steps: performing stirring and mixing; performing addition and uniform mixing; performing ultrasonic emulsification; performing dissolution and stirring; performing high-pressure homogenization; and performing standing and filtration. According to the emulsifying essence disclosed by the invention, primary emulsifying solutions are homogenized, so that the dispersion uniformity of the essence emulsifying solutions is further improved, and the layering probability of the emulsified essence is reduced; the compound preservative formed by compounding sodium dehydroacetate, chitosan and tea polyphenols is added into the emulsifying solutions, so that the corrosion resistant performance of the emulsified essence is effectively promoted, and the effects of extending the storage time and prolonging the service life of the emulsified essence can be achieved.

The invention discloses an attapulgite mixing agent and a preparation method thereof, and belongs to the technical field of auxiliary materials. The attapulgite mixing agent comprises the following materials: 10-12 parts of resin, 32-42 parts of foundation soil, 15-20 parts of organic montmorillonite, 5-10 parts of inorganic material powder, and 4-6 parts of a synergist. According to the attapulgite mixing agent and the preparation method thereof, the purpose of self-reinforcing and toughening of the mixing agent is effectively achieved; a synergist and a stabilizer are utilized; on the premise of ensuring stability, the emulsifier and the expanded graphite are matched to achieve effective thickening effect so that paint film is plump, the probability of sedimentation and layering is reduced, and pin hole filling performance is good. Resin is added during preparation and directly matched with color masterbatch to form powder, the effects of increasing the color and improving the adhesive force can be achieved in the matching process of paint vehicles with different color values, the chemical inertness of attapulgite is matched, the effective chemical resistance is achieved, the growth of microorganisms is inhibited, and the environmental protection property is high.

The invention provides a process for solving the problem of layering during graphene processing. According to the process, the layering rate of a die-cut product is decreased, and the quality of the product is ensured. According to the process, a self-contained film of graphene is stripped in advance before die cutting, then a release film with a double-sided adhesive layer is composited on the back surface of the graphene, the upper surface of the double-sided adhesive layer is bonded to the back surface of the graphene, and then the graphene bonded with the release film through the double-sided adhesive layer is cut off through a cutting die; and a gap area between every two adjacent sets of products of different sheets is cut into a filling middle area through the cutting die, and the filling middle areas are not connected with the adjacent products away from the filling middle areas.

A substrate of the lead frame comprises a plurality of substrates, a flow suppression hole is formed in a substrate epitaxial region of each substrate, and the distance from the edge of the outermost side of the flow suppression hole to the edge of the substrate epitaxial region is 0.2 mm-0. 5 mm. The flow suppression holes are formed in the epitaxial area of the lead frame substrate, diffusion of the light guide glue is controlled through surface tension of the light guide glue under the condition that box dam glue is not used in the light guide glue dispensing process, the radian of the light guide glue is prevented from being reduced, the complexity of raw materials in a packaging body is reduced, the reliability of components is improved, box dam materials are omitted, and the production cost is reduced. And the cost is reduced.

The invention discloses a display panel capable of being bent in a solid state and a display device. The display panel comprises a first functional layer, an adhesive layer and a second functional layer which are arranged in a stacked mode, and a hollow deformable part which is located in the adhesive layer and communicated with the adhesive layer, and a flowable medium is arranged in the deformable part. In this way, the probability of layering between the adhesive layer and the adjacent functional layers can be reduced.

The invention discloses a manufacturing method of a rigid-flex printed circuit board with multi-step buried blind holes. The manufacturing method comprises the steps of manufacturing of an inner-layercopper flexible board, manufacturing of a middle-layer copper flexible board and manufacturing of an outer-layer copper flexible board. The manufacturing method of the inner-layer copper soft board comprises the steps of preprocessing, copper deposition, copper plating, post-processing, CVL pasting, pressing, baking and lamination waiting. The manufacturing method of the middle-layer copper softboard comprises the following steps: preprocessing, laminating with an inner-layer copper soft board to be laminated, laminating, punching, milling blind holes, removing glue slag, depositing copper,plating copper, post-processing, roughening and laminating. The manufacturing method of the outer-layer copper soft board comprises the steps of preprocessing, lamination with a middle-layer copper soft board to be laminated, lamination, punching, blind hole milling, glue residue removal, hole metallization, copper plating and post-processing. The multiple layers of copper soft boards in the rigid-flexible combined board are divided into three groups according to the inner part, the middle part and the outer part, and the rigid-flexible combined board with the multi-step buried blind holes ismanufactured through processing and laminating respectively. The processing efficiency is high, and the plate explosion rate and the layering rate of the laminated final product are low.

The invention discloses a circuit board hole filling method and a circuit board. The circuit board hole filling method comprises the steps of forming blind holes in the circuit board; forming a firstconductive layer on the hole wall of the blind hole by using a deposition process and a flash plating process in sequence, wherein the volume of the blind hole is greater than that of the first conductive layer; and forming a second conductive layer on the first conductive layer by using a hole filling electroplating process to fill the blind hole, wherein the hole filling electroplating process comprises a pre-plating process and an electroplating process which are carried out in sequence, the current density of the pre-plating process is smaller than the current density of the electroplatingprocess, and the time of the pre-plating process is less than the time of the electroplating process. By means of the mode, the bonding force between the first conductive layer and the second conductive layer can be improved, the probability that the first conductive layer and the second conductive layer are broken and layered when a thermo-mechanical load is large is reduced, and then the reliability of the circuit board is improved.

The invention discloses a semiconductor packaging device and a preparation method thereof, and belongs to the technical field of semiconductor packaging. The preparation method comprises the steps that a first packaging body is provided, the first packaging body comprises a chip, first conductive columns and a protection layer, the chip is provided with a first main surface and a second main surface which are oppositely arranged, the first main surface is provided with a plurality of chip electrodes, the first conductive columns are located at the positions of the chip electrodes and electrically connected with the corresponding chip electrodes, and the protection layer is arranged on the first conductive columns; the protective layer covers the first conductive column; forming a first plastic packaging layer which covers the first packaging body from one side of the first main surface, and exposing the second main surface from the first plastic packaging layer; removing part of the first plastic package layer and part of the protective layer from one side of the first main surface, so that one end, far away from the chip, of the first conductive column is exposed from the protective layer and the first plastic package layer; and the flatness of the surface of one side of the protective layer deviating from the chip is greater than that of the surface of one side of the first plastic packaging layer deviating from the chip. The reliability of the semiconductor packaging device can be improved.

The invention discloses a construction method and structure of an antiskid surface of a pavement and belongs to the technical field of construction of the antiskid surface of the pavement. The structure comprises drainage layers laid on the two sides of the pavement, an upper surface layer, a middle surface layer and a lower surface layer are sequentially laid between the drainage layers on the two sides from top to bottom, and an antiskid surface layer located above the drainage layers is laid on the upper surface layer. The preparation method of the antiskid layer comprises the following steps of: S1, heating asphalt to 90-110 DEG C for softening the asphalt; S2, stirring and mixing limestone and diabase to form a mixture, and heating the mixture to 175-185 DEG C; and S3, stirring the softened asphalt and the mixture for 5-10 minutes to form the antiskid surface layer. The structure is simple in structure, forms the antiskid surface on the pavement, enhances the antiskid capacity of the pavement, and improves the strength of the pavement.