The invention discloses a manufacturing method of a rigid-flex
printed circuit board with multi-step buried blind holes. The manufacturing method comprises the steps of manufacturing of an inner-layercopper flexible board, manufacturing of a middle-layer
copper flexible board and manufacturing of an outer-layer
copper flexible board. The manufacturing method of the inner-layer
copper soft board comprises the steps of preprocessing,
copper deposition,
copper plating, post-
processing, CVL pasting, pressing, baking and lamination waiting. The manufacturing method of the middle-layer copper softboard comprises the following steps: preprocessing, laminating with an inner-layer copper soft board to be laminated, laminating,
punching, milling blind holes, removing glue
slag, depositing copper,plating copper, post-
processing, roughening and laminating. The manufacturing method of the outer-layer copper soft board comprises the steps of preprocessing, lamination with a middle-layer copper soft board to be laminated, lamination,
punching,
blind hole milling, glue residue removal, hole metallization,
copper plating and post-
processing. The multiple
layers of copper soft boards in the rigid-flexible combined board are divided into three groups according to the inner part, the middle part and the outer part, and the rigid-flexible combined board with the multi-step buried blind holes ismanufactured through processing and laminating respectively. The processing efficiency is high, and the plate explosion rate and the layering rate of the laminated final product are low.