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Process for solving problem of layering during graphene processing

A graphene and problem-solving technology, applied in the field of graphene die-cutting processing, can solve the problems of large gap between products, easy delamination of heavy films, easy deviation of light films, etc., to reduce delamination rate, reduce peeling force, Ensure the effect of quality

Active Publication Date: 2020-11-17
SUZHOU ANJIE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. At present, there are restrictions on the die-cutting process film and the shipping film.
[0004] 2. Since the raw material of graphene is flakes, the gap between the product and the product is relatively large, which causes the air wrapped around the edge to be squeezed into the product.

Method used

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  • Process for solving problem of layering during graphene processing

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Embodiment Construction

[0017] A process to solve the problem of delamination during graphene processing, see figure 1 , figure 2 : Before die-cutting, the self-contained film 2 of the graphene 1 is peeled off, and then the release film 4 with the double-sided adhesive layer 3 is laminated on the back of the graphene 1, and the upper surface of the double-sided adhesive layer 3 is bonded with graphite Then the graphene 1 bonded with the release film 4 through the double-sided adhesive layer 3 is cut by a knife die, and the gap area between the two adjacent sets of products 5 of different sheets is cut into Filling the middle area, the filling middle area and the products 5 adjacent to each other are not connected to each other.

[0018] The viscosity of the double-sided adhesive layer 3 is 500g / inch~1000g / inch;

[0019] The double-sided adhesive layer 3 is specifically an organic material silicone layer, and the specific thickness of the double-sided adhesive layer 3 is 0.005±0.0005mm to ensure that the...

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Abstract

The invention provides a process for solving the problem of layering during graphene processing. According to the process, the layering rate of a die-cut product is decreased, and the quality of the product is ensured. According to the process, a self-contained film of graphene is stripped in advance before die cutting, then a release film with a double-sided adhesive layer is composited on the back surface of the graphene, the upper surface of the double-sided adhesive layer is bonded to the back surface of the graphene, and then the graphene bonded with the release film through the double-sided adhesive layer is cut off through a cutting die; and a gap area between every two adjacent sets of products of different sheets is cut into a filling middle area through the cutting die, and the filling middle areas are not connected with the adjacent products away from the filling middle areas.

Description

Technical field [0001] The invention relates to the technical field of graphene die-cutting processing, in particular to a process for solving the problem of layering during graphene processing. Background technique [0002] Due to the limitation of raw materials, manufacturers cannot effectively control the quality of incoming materials when making graphene. Graphene is laminated with powder to form a graphene material with a certain thickness. The graphene material does not add any binder during the production process, so There is a risk of delamination, which leads to products that are easy to delamination during processing. Research has found that the reasons for graphene to cause delamination are as follows except the material itself: [0003] 1 At present, there are restrictions on the film and shipping film in the die-cutting matching process, a. The light film is easy to deviate; b. The heavy film is easy to layer; [0004] 2. The graphene is sheet material due to the raw ma...

Claims

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Application Information

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IPC IPC(8): B26F1/38C01B32/194
CPCB26F1/38C01B32/194
Inventor 王春生王成朱礼章
Owner SUZHOU ANJIE TECH
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