A matrix type structure of a dustproof, waterproof and sound-transmitting film of a micro electro mechanical sensor

Abstract

The invention discloses a matrix type structure of a dustproof, waterproof and sound-transmitting film of a micro electro mechanical sensor. The structure comprises a supporting layer, a dustproof andwaterproof acoustic transmission film, an adhesive, a PCB and acoustic sensors; one face of the supporting layer is adhesive and adheres to one face of the dustproof and waterproof acoustic transmission film, the other face of the dustproof and waterproof acoustic transmission film adheres to the upper surface of the PCB through the adhesive, and the acoustic sensors are installed on the lower surface of the PCB; the acoustic sensors, the support layer sound hole, the dustproof and waterproof acoustic transmission film vibration area, the adhesive sound hole and the PCB sound hole form an acoustic channel; the multiple acoustic sensors are distributed on the lower surface of the PCB in a matrix mode, so the matrix type dustproof, waterproof and sound-transmitting film structure is correspondingly formed; the waterproof film adheres to the PCB through an adhesive, and batch products can be produced at a time. The acoustic sensors are covered with the expanded polytetrafluoroethylene film formed by the highly-fibrillated ePTFE microstructure, and the structure has the insertion acoustic loss lower than 5 dB under 1 kHz and the water pressure resistance of at least one meter or above.

Description

technical field [0001] The invention relates to consumer electronics products, in particular to a structure of a dustproof, waterproof and sound-permeable membrane for a matrix micro-electromechanical sensor. Background technique [0002] In this new era of rapidly evolving networks, portable electronic devices of all kinds, from wearables to home assistants, increasingly utilize MEMS microphones to accurately capture almost any sound. Apple mobile phones have opened the era of large-scale application of MEMS microphones in smartphones. As the manufacturing process of MEMS microphones matures, its shipments continue to increase. However, during the high-volume assembly of printed circuit boards for mobile phones, cameras, and other devices, there are several technical issues that can compromise the integrity of MEMS microphones, including pressure rises caused by extreme heat during reflow soldering, particle contamination, and solder , these factors may damage the MEMS mic...

AI Technical Summary

Problems solved by technology

[0003] Applying dustproof, waterproof and sound-permeable membrane technology to the production process of MEMS microphones is the most widely used solution at present. However, after mounting the MEMS microphone on the circuit board, the dustproof, waterproof and sound-permeable The film is pasted on the sound hole of the MEMS microphone corresponding to the circuit board or on the sound hole of the MEMS microphone case. During the production process, there is an additional process of attaching a dust-proof and waterproof sound-permeable film. Film yield detection, manual removal and other processes, so the cost is high

Compared with the previous technology, using the semiconductor packaging process to install the dust-proof, waterproof and sound-permeable membrane inside the MEMS microphone has a higher technical quality stability. Then, this technology is to make the product into individual units and deliver them in wafer format , the customer needs to use high-speed chip placement equipment to put the dust-proof, waterproof and sound-permeable membrane into the MEMS microphone. Only one product can be produced at a time, and the efficiency is relatively low.

[0004] In the future, the dust-proof, waterproof and sound-permeable application trend of MEMS microphones will be to install the dust-proof, waterproof and sound-permeable film inside the MEMS microphone using semiconductor packaging technology, but this technology has the problem of high cost and low efficiency.

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