Semiconductor packaging device and preparation method thereof

Abstract

The invention discloses a semiconductor packaging device and a preparation method thereof, and belongs to the technical field of semiconductor packaging. The preparation method comprises the steps that a first packaging body is provided, the first packaging body comprises a chip, first conductive columns and a protection layer, the chip is provided with a first main surface and a second main surface which are oppositely arranged, the first main surface is provided with a plurality of chip electrodes, the first conductive columns are located at the positions of the chip electrodes and electrically connected with the corresponding chip electrodes, and the protection layer is arranged on the first conductive columns; the protective layer covers the first conductive column; forming a first plastic packaging layer which covers the first packaging body from one side of the first main surface, and exposing the second main surface from the first plastic packaging layer; removing part of the first plastic package layer and part of the protective layer from one side of the first main surface, so that one end, far away from the chip, of the first conductive column is exposed from the protective layer and the first plastic package layer; and the flatness of the surface of one side of the protective layer deviating from the chip is greater than that of the surface of one side of the first plastic packaging layer deviating from the chip. The reliability of the semiconductor packaging device can be improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor packaging, and in particular, to a semiconductor packaging device and a preparation method thereof. Background technique [0002] When packaging a semiconductor chip, a plastic encapsulation process is usually used, that is, the chip is embedded in an epoxy molding compound (EMC). However, the material of the plastic sealing layer formed by the epoxy molding compound is relatively rough and the surface flatness is low. When the plastic sealing body is further processed, the interface stability of the combination of other functional layers and the plastic sealing layer is not enough, which makes the other functional layers and the plastic sealing layer easy to delaminate. , affecting the electrical connection between the chip and other functional layers, thereby reducing the reliability of the semiconductor package device. SUMMARY OF THE INVENTION [0003] The main technical prob...

AI Technical Summary

Problems solved by technology

However, the material of the plastic seal layer formed by epoxy molding compound is relatively rough, and the surface flatness is low. When the plastic seal body is further processed later, the interface stability of the combination of other functional layers and the plastic seal layer is not enough, which makes the other functional layers and the plastic seal layer easy to delaminate. , affecting the electrical connection between the chip and other functional layers, thus reducing the reliability of semiconductor packaged devices

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