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Bending resistance, high bonding strength flexible LED encapsulation adhesive and preparation method

A technology of encapsulation adhesive and phosphoric acid group, which is applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problem that it is difficult to meet the long-term use requirements of flexible LED chip encapsulation adhesives, and polyurethane has poor water resistance and heat resistance , The internal stress of the cured product is small, etc., to achieve excellent elastic recovery and stress absorption capacity, excellent impact resistance, and good optical properties

Active Publication Date: 2021-04-13
CHANGZHOU BAIJIA NIANDAI FILM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the packaging materials mainly include epoxy resin, polyurethane, silica gel, etc. Among them, epoxy resin-based packaging materials have poor thermal stability, easy yellowing, brittleness after aging, and poor UV resistance; polyurethane has poor water resistance and heat resistance. , can not be used in outdoor, underwater and other environments; silicone LED packaging materials mainly form cured products through silicon hydrogen addition reaction between silicone materials, which have excellent optical properties, high and low temperature resistance, and small internal stress of cured products, etc. Advantages, has become the mainstream material of flexible LED packaging adhesive, but it is difficult to meet the long-term use requirements of flexible LED chip packaging adhesive

Method used

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  • Bending resistance, high bonding strength flexible LED encapsulation adhesive and preparation method
  • Bending resistance, high bonding strength flexible LED encapsulation adhesive and preparation method
  • Bending resistance, high bonding strength flexible LED encapsulation adhesive and preparation method

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preparation example Construction

[0034] further, see figure 1 , the present invention also provides a method for preparing an encapsulant, comprising: sequentially mixing ethoxy polyformamide and acrylate containing phosphoric acid groups into an organic solvent; addition reaction to obtain an addition product; removal of the organic solvent; Condensation reaction to obtain condensation products; adding auxiliary agents; cross-linking reaction to obtain cross-linked products.

[0035] Concrete, ethoxypolyformamide can be mixed in organic solvent chloroform, form ethoxypolyformamide chloroform solution, then the acrylate containing phosphoric acid group is dissolved in ethoxypolyformamide chloroform solution; Then in Stir at 50°C for 12 hours to undergo an addition reaction, so that the amino group of ethoxy polyformamide is added to the double bond of acrylate containing phosphoric acid groups to form an addition product; then keep the temperature for about 3 hours under nitrogen flow, remove Organic solvent...

Embodiment 1

[0057] (1) Addition reaction

[0058] Ethoxypolyformamide (R=CH 2 , R'=CH 2 , x=1, y=5) 15 mole fractions, ethoxy polyformamide (R=CH 2 , R'=CH 2 , x=1, y=11) 30 mole fractions are dissolved in the chloroform solution, then the polyacrylic acid (R=CH 2 ,X=H) 45 mole fractions are dissolved in ethoxy polyformamide chloroform solution, stirred at 50°C for 12h, so that the amino group of ethoxy polyformamide is added to the double bond of acrylate with phosphoric acid group , to obtain the addition product. The temperature was maintained for about 3 h under nitrogen flow, and the chloroform was removed.

[0059] (2) Condensation reaction

[0060] Raise the temperature to 80°C and keep it for about 4 hours, so that the phosphoric acid group containing acrylate and the amino group of ethoxy polyformamide undergo condensation reaction to obtain a condensation product. And add N,N-dimethylformamide to obtain a uniform and transparent polymer solution.

[0061] (3) Cross-linki...

Embodiment 2

[0064] (1) Addition reaction

[0065] Ethoxypolyformamide (R=CH 2 , R'=CH 2 , x=1, y=5) 22.5 mole fractions, ethoxypolyformamide (R=CH 2 , R'=CH 2 , x=1, y=11) 22.5 mole fractions were dissolved in chloroform solution, and polyacrylic acid (R=CH 2 , X=H) 45 mole fractions are dissolved in ethoxy polyformamide chloroform solution, stirred at 50°C for 12h, so that the amino group of ethoxy polyformamide is added to the double bond of acrylate with phosphoric acid group , to obtain the addition product. The temperature was maintained for about 3 h under nitrogen flow, and the chloroform was removed.

[0066] (2) Condensation reaction

[0067] Raise the temperature to 80°C and keep it for about 4 hours, so that the phosphoric acid group containing acrylate and the amino group of ethoxy polyformamide undergo condensation reaction to obtain a condensation product. And add N,N-dimethylformamide to obtain a uniform and transparent polymer solution.

[0068] (3) Cross-linking r...

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Abstract

The invention belongs to the field of photovoltaic encapsulation, and in particular relates to a flexible LED encapsulation adhesive with bending resistance and high bonding strength and a preparation method. The flexible LED encapsulation adhesive includes the following raw materials: acrylate containing phosphoric acid groups, ethoxy polyformamide, organic solvents, and auxiliary agents; the flexible LED encapsulation adhesive with high bending resistance and high bonding strength prepared by the invention not only has excellent Adhesive strength, but also has excellent high peel strength, bending resistance, tear resistance, impact resistance, good cold and heat shock resistance, thermal stability, anti-yellowing, greatly improving the flexible LED The service life and stability of the lamp under strong dynamic and static loads outdoors.

Description

technical field [0001] The invention belongs to the field of photovoltaic encapsulation, and in particular relates to a flexible LED encapsulation adhesive with bending resistance and high bonding strength and a preparation method. Background technique [0002] With the development of outdoor advertising and landscape lighting, more and more flexible LED advertising screens are used in public places, such as flexible LED advertising screens in outdoor hanging decoration, indoor commercial decoration and household fish tanks and other fields. In the outdoor use environment, the flexible LED light strip is bent into different shapes to form different shapes, such as hanging or wrapping on the surface of the building. The flexible LED light strip is made of many LED chips embedded in a flexible steel strip to control the display effect of each different chip, and then glue the PET film and the steel strip containing the chips through the adhesive film to isolate the LED chips f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J143/02C09J11/06C08F130/02C08F2/48
CPCC08F2/48C08F130/02C08L2201/08C08L2203/206C09J11/06C09J143/02C08K5/526C08K5/3435
Inventor 熊唯诚边祥成范国威朱宙峰周乐茹正伟袁榆程
Owner CHANGZHOU BAIJIA NIANDAI FILM TECH CO LTD
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