Manufacturing process of high-frequency copper clad plate

A manufacturing process and technology of copper clad laminate, applied in the field of high frequency copper clad laminate manufacturing process, can solve the problems of damage to the end face of the copper clad laminate, difficulty in controlling the strength, and difficulty in collecting scraps, so as to avoid damage, improve grinding efficiency and reduce residual rate. Effect

Active Publication Date: 2020-11-20
聚创(江门)新材料科技有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above problems, the present invention provides a high-frequency copper-clad laminate manufacturing process, which can solve the problem that when sanding, due to the small edge surface of the copper-clad laminate, the sandpaper may come into contact with the upper and lower end surfaces of the copper-clad laminate, resulting in cladding. The end face of the copper plate is damaged, and it is difficult to control the strength of manual grinding, often there will be excessive grinding, and the scraps generated by grinding are difficult to collect, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing process of high-frequency copper clad plate
  • Manufacturing process of high-frequency copper clad plate
  • Manufacturing process of high-frequency copper clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0032] Such as Figure 1 to Figure 5 As shown, a high-frequency copper-clad laminate manufacturing process uses an auxiliary trimming device, which includes a base 1, a U-shaped frame 2, a pressing cylinder 3, a positioning block 4, a trimming unit 5, The driving unit 6 and the air suction unit 7 use the above-mentioned auxiliary trimming equipment to manufacture high-frequency copper-clad laminates as follows:

[0033] S1. Press forming: the adhesive is evenly poured on both sides of the base film, and the copper foil on both sides is pressed and combined with the base film by...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a manufacturing process of a high-frequency copper clad plate. The cooperation is completed through the cooperation of a base, a U-shaped frame, a downward pressure cylinder, apositioning block, a trimming unit, a driving unit and an air suction unit. The problems that the end surface of the copper clad plate is damaged due to the fact that sandpaper may come into contact with the upper and lower end surfaces of the copper clad plate when sanding due to small edge surface of the copper clad plate, excessive polishing often occurs due to difficult to control the strengthof manual polishing, and material chips produced by polishing are difficult to collect are solved.

Description

technical field [0001] The invention relates to the technical field of manufacturing copper-clad laminates, in particular to a manufacturing process for high-frequency copper-clad laminates. Background technique [0002] Copper-clad laminate, also known as the base material, is a plate-shaped material formed by impregnating the reinforcing material with resin, covering one or both sides with copper foil, and hot pressing, called copper-clad laminate. It is the basic material for PCB, often called substrate. When it is used in the production of multi-layer boards, it is also called core board. In the manufacturing process of copper clad laminates, adhesives are usually used to bond the aluminum foil to the substrate film and then pressed by hot pressing. After pressing, the excess glue The liquid will overflow and solidify on the edge of the copper clad laminate. People remove this overflowing glue by sanding. [0003] However, when sanding, due to the small edge surface of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/033B24B41/02B24B41/06B24B55/12B32B37/10
CPCB24B27/033B24B55/12B24B41/06B24B41/02B32B37/10
Inventor 洪宇豪
Owner 聚创(江门)新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap