Split-screen display driving method of super-definition liquid crystal module

Abstract

A split-screen display driving method of a super-definition liquid crystal module comprises the following steps that a single-chip microcomputer is adopted as a main control chip, and all I / O ports inthe single-chip microcomputer are classified; two SSD1963 display controllers are selected, one SSD1963 display controller is connected with an I / O port in the single chip microcomputer, and the twoSSD1963 display controllers are connected in a cascaded mode; an output port of the SSD1963 display controller is connected with a TFT module through a circuit; different driving conditions are set for the two SSD1963 display controllers, and data commands are sent through the single-chip microcomputer, so that the two SSD1963 display controllers basically and alternately display data sent by thesingle-chip microcomputer at the same time, and the SSD1963 display controllers achieve split-screen display. According to the invention, the single-chip microcomputer and the two SSD1963 display controllers are cascaded; according to the invention, the test of the module below FHD can be driven, the original 800*480*24BIT data drive is improved, the operation cost of the module processing factoryfor testing the liquid crystal module above high definition is reduced, and the method can be applied to the design of a test mainboard in a company. And the test detection and the test efficiency ofa module factory are facilitated.

Description

technical field [0001] The invention relates to the technical field of liquid crystal modules, in particular to a split-screen display driving method of an ultra-clear liquid crystal module. Background technique [0002] At present, the drive boards using SSD1963 chips on the market have the highest resolution of 800*480*24bit (RGB), and ARM boards are used for resolutions above 800*480*24bit (RGB). In the LCD module industry, the cost of using ARM test boards in general module assembly plants is too high, and both small and large sizes must be shared. Using general test boards and different test adapter boards, for companies with a wide range of development cases, the man-hours and labor costs of switching are relatively large. Each type or each glass IC corresponds to a complete set of side frames, and the test frame borrowed by the customer is too costly, and the general ARM board is sold by the solution company, and the test cost is very high. Therefore, there is an ur...

AI Technical Summary

Problems solved by technology

Using general-purpose test boards and different test adapter boards, for companies with a wide range of development cases, the man-hours and labor costs of switching are relatively large

Each type or each glass IC corresponds to a complete set of side frames, and customers borrow test frames, which wastes too much cost. Generally, ARM boards are sold by solution companies, and the test cost is very high.

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