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Component for film formation apparatus and film formation apparatus provided with component for film formation apparatus

A film-forming device and component technology, which is applied in the field of film-forming devices, can solve the problems of sputtering film peeling and falling off, polluting the film-forming chamber, etc.

Active Publication Date: 2020-11-27
NIHON SHINKU GIJUTSU KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this state, the following problem becomes remarkable: that is, the sputtered film adhering to the member for film forming apparatus easily exceeds the critical point of adhesion, the sputtered film peels off and falls off, and particles such as fine particles or dust are generated. Particles float in the film-forming chamber and pollute the film-forming chamber

Method used

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  • Component for film formation apparatus and film formation apparatus provided with component for film formation apparatus
  • Component for film formation apparatus and film formation apparatus provided with component for film formation apparatus
  • Component for film formation apparatus and film formation apparatus provided with component for film formation apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] In Example 1, a substrate made of SUS304 with a planar size of 80 mm×100 mm and a thickness of 2 mm was used, and the sprayed film 3 (thickness: 350 μm) composed of Al alone was formed on its surface by arc spraying. In order to obtain the anchoring effect, dry sandblasting is performed on the surface of the SUS304 substrate before forming the sprayed film to make the surface rough. As the spraying method, an arc spraying method was performed. Four different samples (Al-1, Al-2, Al-3, Al-4) under the conditions shown in Table 1 described later were produced.

[0048] In addition, unlike the above-mentioned samples, a sprayed coating composed of an Al alloy whose additive element is Si or Ti was also prepared. At this time, the Si content is in the range of 4.81 to 11.6 at % (atomic %), and the Ti content is in the range of 1.1 to 2.9 at %.

Embodiment 2

[0052] In Example 2, the same substrate as in Example 1 was used, and the sprayed film 3 (thickness: 350 μm) made of a Cu—Al alloy was formed on the surface by arc spraying. The composition of the Cu-Al alloy is Cu-7.9% by mass Al. In the same manner as in Example 1, in order to obtain an anchoring effect, dry blasting was performed on the surface of the substrate before forming the sprayed film. Thereby, the surface of the base material is roughened. As the spraying method, an arc spraying method was performed. Two different samples (Cu-Al-1, Cu-Al-2) of the spraying conditions shown in Table 1 mentioned later were produced.

[0053] In addition, unlike the above-mentioned samples, a Cu film containing no additive elements (a sprayed film composed of Cu alone) and a sprayed film composed of Cu—Al were also fabricated. At this time, regarding the sprayed coating made of a Cu—Al alloy, the Al content was set within a range of 6.7 to 11.1% by mass.

[0054] Table 1 shown bel...

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Abstract

The present invention relates to a component for a film formation apparatus and a film formation apparatus provided with the component for a film formation apparatus. The member for a film formation apparatus of the present invention has: a surface exposed to a film formation atmosphere; and a sprayed film formed on the surface and made of Al or Al alloy or Cu or Cu alloy. The surface roughness Ra[[mu]m] of the sprayed film is in the range of 50 to 70.

Description

technical field [0001] The present invention relates to a member for a film-forming apparatus that is excellent in the adhesiveness of an attached film and the effect of relieving peeling stress, and a film-forming apparatus including the member for a film-forming apparatus. Background technique [0002] In recent years, various coatings have been formed on objects to be processed (such as Si substrates, etc.) by using various coating formation methods (such as sputtering, CVD, etc.) Manufacture of semiconductor products. In this case, the film formed on the target object cannot avoid the phenomenon that the film also adheres to various film forming apparatus components existing around the object during film formation in the film forming chamber. [0003] This phenomenon becomes more remarkable as the number of times (batches) of film formation increases. That is, generally, the object to be processed is replaced after each film forming operation, but various film forming ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/02C23C14/34C23C4/131C23C4/06
CPCC23C14/025C23C14/34C23C4/131C23C4/06C23C16/4404C23C14/564C23C4/08C23C4/067
Inventor 门脇豊吉田敏伸赤瀬仁荣高山孝信
Owner NIHON SHINKU GIJUTSU KK