Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ship height measurement method and system

A ship and height technology, applied in the field of ship height measurement, can solve the problems of limited working distance, high computing power requirements, and long calculation time, so as to reduce the amount of calculation and improve the efficiency of measurement and calculation

Active Publication Date: 2021-03-05
BEIJING UPHOTON OPTOELECTRONICS DEV CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Correspondingly, the existing ship height measurement technology is affected by the installation design and measurement principle of the device, the working distance is limited, and it cannot be moved flexibly, so the flexibility of use is insufficient
[0004] In addition, for the height measurement method based on the three-dimensional data of the ship, it is true that the highest point of the ship can be searched and the height of the ship can be calculated based entirely on the three-dimensional data, but this often requires high computing power of the system, and the calculation time is long, which is not conducive to rapid take height measurements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ship height measurement method and system
  • Ship height measurement method and system
  • Ship height measurement method and system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. For ease of description, only parts related to the invention are shown in the drawings.

[0048] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0049] figure 1 It is a schematic flow chart of the ship height measurement method 100 according to the embodiment of the present invention. Such as figure 1 As shown, the ship height measurement method 100 includes the following processing:

[0050] S110: Obtain a three-dimensional point cloud of a ship located on the wat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present application discloses a method for calculating the height of a ship, which includes: acquiring a three-dimensional point cloud of a ship on the water surface; projecting the three-dimensional point cloud onto a target plane to obtain a corresponding two-dimensional point cloud, the target plane being parallel to the vertical Direction; in the target plane, process the two-dimensional point cloud, and fit the straight line representing the intersection position of the ship and the water surface, that is, the hull-water surface intersection line; in the target plane, calculate the two-dimensional point cloud and the fitted hull ‑The furthest distance from the intersection of the water surface as the height of the ship. The application also discloses a ship height measuring and calculating system. According to the embodiment of the present invention, the height detection of the ship can be performed more flexibly, and at the same time, it is beneficial to reduce the calculation amount of height measurement and improve the efficiency of measurement and calculation.

Description

technical field [0001] The present invention relates to a three-dimensional measurement technology, in particular to a ship height measurement method and system based on laser three-dimensional scanning technology. Background technique [0002] When a ship passes through a lock or bridge, in order to avoid collision accidents due to the height of the ship or the container it carries, it is necessary to measure the height of the ship by remote sensing. For this purpose, different ship height measurement techniques have been developed. For example, the ship height measurement technology based on image processing uses a camera to shoot a ship, and then obtains the ship height by processing the captured image. In addition, a ship height measurement technology based on laser 3D scanning has also been developed. For example, Chinese patent CN109178234A discloses a ship freeboard height measurement system, which uses a water level gauge and a laser radar installed under a bridge ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/62
CPCG06T2207/10028G06T2207/10044G06T7/62
Inventor 姜璐李沛林薛昭
Owner BEIJING UPHOTON OPTOELECTRONICS DEV CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com