Laminating method of flexible circuit board

A flexible circuit board, circuit board technology, applied in the directions of printed circuit, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve the problems of upper and lower layer offset, fluctuation, expansion and contraction difference, etc., to avoid offset and positioning accuracy. High, the effect of improving the alignment accuracy

Inactive Publication Date: 2020-11-27
AAC TECH SHUYANG +1
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Problems solved by technology

[0004] However, in the above-mentioned over-layer manufacturing of multi-layer flexible circuit boards, the position of the PIN will be displaced; the action when the PIN is withdrawn may cause the deviation of the upper and lower layers; during mass production, there will be fluctuations in the expansion and contraction of the inner and outer layers. As a result, there is a certain difference in the expansion and contraction of the inner and outer layers and the fixture, which in turn limits the high density of the circuit

Method used

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  • Laminating method of flexible circuit board
  • Laminating method of flexible circuit board
  • Laminating method of flexible circuit board

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] Please also see figure 1 , figure 2 as well as Figure 4 , the present invention provides a method for stacking flexible circuit boards 100. The flexible circuit board 100 includes an inner flexible circuit board 1 and N layers of outer flexible circuits stacked on the inner flexible circuit board 1 in sequence. Plate 2, N is a positive integer, and the plate stacking method includes the following steps

[0030] Step S1, setting marking points 3: se...

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Abstract

The invention provides a lamination method of a flexible circuit board. The flexible circuit board comprises an inner layer flexible circuit board and N layers of outer layer flexible circuit boards stacked on the inner layer flexible circuit board in sequence, and N is a positive integer. The laminating method comprises the following steps: setting identification points; building a workbench; adding charges to the flexible circuit board; aligning the inner-layer flexible circuit board with the workbench; and aligning the outer-layer flexible circuit board with the inner-layer flexible circuitboard. Compared with the prior art, the laminating method of the flexible circuit board has the advantages that an image control system is adopted for positioning, and the inner-layer flexible circuit board and the outer-layer flexible circuit board are fixed through electrostatic adsorption, so that the alignment precision is greatly improved.

Description

【Technical field】 [0001] The invention relates to the technical field of flexible circuit boards, in particular to a method for stacking flexible circuit boards. 【Background technique】 [0002] With the rapid development of the communication industry, the size of many electronic products is getting smaller and smaller, and the number of layers of the flexible circuit board inside is getting higher and higher. In the manufacturing process of multi-layer flexible circuit boards, the alignment accuracy between layers is an important parameter, which directly determines the annular ring value of via holes, and has an important impact on the high density of circuit layout. In addition, alignment accuracy directly affects the yield of multilayer flexible circuit boards. [0003] Before multi-layer lamination of traditional multi-layer flexible circuit boards, a jig is used to cover the PIN laminate, and the positioning is performed through the jig hole between the PIN nail and th...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4638H05K2203/166
Inventor 陈康韩佳明陈勇利
Owner AAC TECH SHUYANG
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