Heat dissipation device and processor
A heat dissipation device and refrigeration device technology, applied in the field of communication, can solve problems such as difficult implementation, high sealing design, and strong volatility of the medium
Active Publication Date: 2020-12-01
HUAWEI TECH CO LTD
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Problems solved by technology
However, a two-phase working medium with a low boiling point is used, but this medium is too volatile, requiring a relatively high sealing design for the tank, which is difficult to implement in the actual working environment
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[0030] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.
[0031] In order to facilitate the understanding of the heat dissipation device provided by the embodiment of the present application, its application scenario is firstly explained. The heat dissipation device is used to dissipate heat from the single board 30. A large amount of heat, in order to ensure the normal operation of the single board 30 , it is necessary to dissipate heat from the single board 30 , so the embodiment of the present application provides a heat dissipation device to dissipate heat from the single board 30 .
[0032] first reference figure 1 , figure 1 The structure of a heat dissipation device provided by the embodiment of the present application is shown. The heat dissipation device provided in the embodiment of the present application includes an i...
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The invention provides a heat dissipation device and a processor. The heat dissipation device comprises an immersion tank. A liquid medium is contained in the immersion tank. When the heat dissipationdevice is used, a single board is immersed in the liquid medium, and heat dissipation is conducted on the single board through heat absorption of the liquid medium. The device also comprises a condenser soaked in a liquid medium, and the liquid medium is cooled through the arranged condenser. And the liquid medium in the immersion tank is used as a medium to transfer the heat of the veneer to thecondenser in the immersion tank. And then the condenser takes away the heat and dissipates the heat through a refrigerating device which is connected with the condenser and is used for heat exchangeof the condenser. It can be seen through the description that in the embodiment, heat is taken away directly through backflow formed by the temperature of the liquid medium, and due to the fact that the liquid medium has no phase change, the sealing requirement for the heat dissipation device is lowered, and meanwhile the heat dissipation effect on the single board is guaranteed.
Description
technical field [0001] The present application relates to the technical field of communications, and in particular to a heat dissipation device and a processor. Background technique [0002] As the integration of electronic components increases, the power consumption density of chips is also increasing. The traditional air-cooled heat dissipation method can no longer meet the growing heat dissipation demand. With its high heat dissipation efficiency, liquid cooling technology provides a new solution for the heat dissipation of high heat flux density electronic devices, and has been applied in data centers, servers and other fields. [0003] The more commonly used method in the prior art is to use immersion liquid cooling technology. The immersion liquid cooling is a form of liquid cooling technology, that is, the equipment is immersed in the liquid, and the heat of the equipment is transferred to the liquid through direct contact with the liquid and brings Walk. In specifi...
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IPC IPC(8): H05K7/20
CPCH05K7/203H05K7/20327H05K7/20309H05K7/20318H05K7/20809H05K7/20236H05K7/20272
Inventor 贾晖李霁阳王超
Owner HUAWEI TECH CO LTD