Check patentability & draft patents in minutes with Patsnap Eureka AI!

Method and system for establishing semiconductor defect scanning program

A technology for defect scanning and method establishment, which is applied in the field of semiconductor manufacturing and can solve the problems of consuming human resources and engineering time

Inactive Publication Date: 2020-12-04
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

How to accurately and automatically detect wafer defects is a complex and challenging task
At present, for different product numbers, the defect detection scanning program needs to be re-established, which consumes a lot of human resources and engineering time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for establishing semiconductor defect scanning program
  • Method and system for establishing semiconductor defect scanning program
  • Method and system for establishing semiconductor defect scanning program

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0037] In the first embodiment, a method for establishing a semiconductor defect scanning program includes the following steps:

[0038] S1, select the process platform and process flow;

[0039] S2, under the above process platform and process flow, select the benchmark product;

[0040] S3, collect defect scanning program data after different process levels of the benchmark product, and establish a database;

[0041] S4, comparing the process platform, process flow and corresponding material parameters of the new product with the process platform, process flow and corresponding material parameters of the benchmark product;

[0042] If there is no difference, after defining the defect scanning area for the new product, use the defect program parameters of the corresponding level of the benchmark product to create a new product scanning program at one time;

[0043] If there is a difference, the new product is used as the benchmark product to establish a database.

[0044] ...

no. 2 example

[0045] In the second embodiment, a method for establishing a semiconductor defect scanning program includes the following steps:

[0046]S1, select the process platform and process flow;

[0047] S2, under the above process platform and process flow, select the benchmark product;

[0048] S3, collect defect scanning program data after different process levels of the benchmark product, and establish a database;

[0049] The area and level of defect scanning can be selected as follows;

[0050] After the oxide layer in the active area is deposited, the acquisition process parameters include: incident light intensity, focusing value, contrast window size, training light intensity of each scanning area, and signal-to-noise ratio designated as a defect;

[0051] After the active area is etched, the acquisition process parameters include: incident light intensity, focusing value, contrast window size, training light intensity of each scanning area, and signal-to-noise ratio design...

no. 3 example

[0057] In the third embodiment, the present invention provides a system for establishing a semiconductor defect scanning program, which can be integrated into a defect scanning machine using computer programming technology, including:

[0058] Selection module, which is used to select the selection process platform and process flow of semiconductor devices, and select the benchmark product under the above process platform and process flow;

[0059] A collection module, which is used to collect defect scanning program data after different process levels of the benchmark product, and establish a database;

[0060] A comparison module, which is used to compare the process platform, process flow and corresponding material parameters of the new product with the process platform, process flow and corresponding material parameters of the benchmark product;

[0061] A program building module, which determines whether to create a new product scanning program according to the comparison...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for establishing a semiconductor defect scanning program. The method comprises the following steps of selecting a process platform and a process flow; selecting a reference product under the process platform and the process flow; collecting the defect scanning program data of the reference product after different process levels, and establishing a database; comparing the process platform, the process flow and the corresponding material parameters of a new product with the process platform, the process flow and the corresponding material parameters of the reference product; if no difference exists, defining a defect scanning area for the new product, and then establishing a new product scanning program at one time by using the defect program parameters of the corresponding levels of the reference product; and if the difference exists, establishing the database by taking the new product as the reference product. The invention further discloses a system for establishing the semiconductor defect scanning program. When the new product is put into production, the defect scanning program of the whole technological process of the product can be automatically established at a time, the defect scanning program establishing efficiency can be greatly improved, and the productivity is improved.

Description

technical field [0001] The invention relates to the field of semiconductor production and manufacturing, in particular to a method for establishing a semiconductor defect scanning program. The invention also relates to a semiconductor defect scanning program establishment system. Background technique [0002] With the rapid development of semiconductor manufacturing technology, the line width of product devices is constantly decreasing, and defects will cause greater damage to product yield. Therefore, improving the ability to capture wafer defects has become an important means to improve semiconductor yield. Defect detection SEM plays an important role in the process of analyzing defects, reducing defects, and improving yield. How to accurately and automatically detect wafer defects is a complex and challenging task. Defect detection technology has become a key technology in the integrated circuit industry. The online defect monitoring method in the integrated circuit ma...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G06F16/20
CPCH01L22/12G06F16/20
Inventor 袁增艺
Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com