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Printed circuit board and printed circuit board strip

A technology for printed circuit boards and insulating layers, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of difficult strip inspection process and assembly process automation

Pending Publication Date: 2020-12-04
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to automate the strip inspection process and assembly process

Method used

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  • Printed circuit board and printed circuit board strip
  • Printed circuit board and printed circuit board strip
  • Printed circuit board and printed circuit board strip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] Hereinafter, configurations and operations of these embodiments will be described in detail with reference to the accompanying drawings. For brief description with reference to the drawings, the same or equivalent components may have the same reference numerals, and descriptions thereof will not be repeated. Terms such as 'first' and 'second' may be used to describe various components, but these components should not be limited by these terms. These terms are only used to distinguish one component from another.

[0038] Hereinafter, various embodiments will be clearly disclosed through the drawings and description of the embodiments. In the description of these embodiments, it should be understood that when an element such as a layer (film), region, pattern or structure is referred to as being formed on, for example, a substrate, layer (film), region, pad or pattern When an element is "on" or "under" another element, it may be located "on" or "under" the other element...

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PUM

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Abstract

A printed circuit board according to an embodiment comprises: a first insulation layer; a plurality of first cavities formed in the central region of the first insulation layer; a plurality of secondcavities formed in the outer region of the first insulation layer, excluding the central region; real dies respectively disposed in the plurality of first cavities; dummy dies respectively disposed inthe plurality of second cavities; a second insulation layer formed on the first insulation layer and filling the first cavities and the second cavities; and a third insulation layer disposed beneaththe first insulation layer, wherein the real dies comprise substantial driving elements and the dummy dies do not comprise the driving elements.

Description

technical field [0001] Embodiments relate to printed circuit boards, and more particularly to component embedded printed circuit boards and printed circuit board strips including such printed circuit boards. Background technique [0002] As electronic devices are miniaturized, electronic components include more functions or may be reduced in size. [0003] In particular, in order to reduce the thickness of portable terminals such as mobile phones or portable computers, it is necessary to significantly reduce the thickness of components mounted therein. In order to miniaturize components, there is an increasing need to reduce the thickness of component packages, and to achieve high functionality by mounting a plurality of integrated circuit chips for various functions in one component package. For this purpose, a component packaging technology such as a chip-embedded (chip-embedded) printed circuit board in which a chip is embedded between an upper printed circuit board and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/11H05K1/02
CPCH05K1/02H05K1/16H05K1/185H05K3/4697H05K3/4652H05K2201/10204H05K1/0271H05K1/0218H05K1/115H05K2201/09009
Inventor 郑元席李尚铭
Owner LG INNOTEK CO LTD