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A kind of amplitude modulation probe card and its probe and amplitude modulation structure

A probe card and probe technology, applied in the field of probe cards, can solve the problem that a single probe card cannot be used universally, etc.

Active Publication Date: 2021-04-02
MAXONE SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the production process of semiconductor devices, it is necessary to visit a large number of circuit contacts in one or more devices multiple times, and move the probe card through the moving mechanism to make the probes contact with the contacts. At the same time, to match the detection process For multiple sets of contacts in the probe card, multiple probe cards need to be set, and the probe card is fixed by the holder. The holder is a polyhedron that can rotate. By setting one or more probe cards on each surface, or setting Multiple movable platforms move the probe card to realize the matching between the probe card and different contact groups. The matching is realized by exchanging the probe card, and a single probe card cannot be used universally

Method used

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  • A kind of amplitude modulation probe card and its probe and amplitude modulation structure
  • A kind of amplitude modulation probe card and its probe and amplitude modulation structure
  • A kind of amplitude modulation probe card and its probe and amplitude modulation structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] This embodiment is an embodiment of an amplitude modulation probe card.

[0070] combine figure 1 As shown, an amplitude modulation probe card includes a probe 1, a probe board 2, a circuit board 3 and an amplitude modulation structure 4, the probe 1 is fixedly arranged on the probe board 2, and one end of the probe 1 is connected to To the circuit board 3, the other end of the probe 1 is clamped on the amplitude modulation structure 4, and the end of the probe 1 is in contact with the contact of the semiconductor device, and the electrical signal is transmitted to the circuit board 3 through the probe 1, and is transmitted by the circuit The board 3 is transmitted to the tester for detection, and the amplitude modulation structure 4 is connected to the detection end of the probe 1. When the amplitude modulation structure 4 adjusts the height of the probe 1, different numbers of probes 1 can be located at lower detection positions. And participate in the detection, the...

Embodiment 2

[0085] This embodiment is an embodiment of a probe of an amplitude modulation probe card.

[0086] The probe of an amplitude modulation probe card disclosed in this embodiment is applied to the amplitude modulation probe card disclosed in the first embodiment.

[0087] combine figure 1 As shown, the probe 1 includes: a probe head 1-1, a curved wire 1-2 and a fixed wire 1-3, one end of the probe head 1-1 is a circular probe for detection, and the probe head 1-1 is a circular probe for detection. The middle part of the needle head 1-1 is clamped on the amplitude modulation structure 4, and the other end of the probe head 1-1 is connected to one end of the curved wire 1-2, and a V-shaped probe head 1 is shown in the embodiment -1, however, it should be understood that the probe head 1-1 can be in the shape of a right angle or a circular arc, so that the front end of the probe head 1-1 is in a lower position to facilitate contact with the contacts, and the probe head 1-1 The rea...

Embodiment 3

[0091] This embodiment is an embodiment of an amplitude modulation structure of an amplitude modulation probe card.

[0092] The AM structure of an AM probe card disclosed in this embodiment is applied to the AM probe card disclosed in Embodiment 1.

[0093] combine figure 1 with figure 2 As shown, the amplitude modulation structure 4 includes: a fixed plate 4-1, an amplitude modulation plate 4-2, an amplitude modulation connecting plate 4-3, a reed 4-4, an amplitude modulation splint 4-5, an amplitude modulation shaft 4-6, and a main roller 4-7 and eccentric roller 4-8, the fixed plate 4-1 is fixedly connected to the circuit board 3, the upper end of the amplitude modulation plate 4-2 is fixedly connected to the amplitude modulation connecting plate 4-3, and the amplitude modulation plate 4-2 The lower end of the amplitude modulation connection plate 4-3 vertically passes through the fixed plate 4-1, the circuit board 3 and the probe plate 2 and then is fixedly connected w...

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Abstract

The invention belongs to the technical field of probe cards, and in particular relates to an amplitude modulation probe card and its probes and an amplitude modulation structure. The probe card includes a probe, a probe board, a circuit board and an amplitude modulation structure. The probes are fixedly arranged On the probe board, one end of the probe is connected to the circuit board, and the other end of the probe is clamped on the amplitude modulation structure. A curved wire is set on the probe to make the probe have longitudinal elastic deformation. On the probe head The amplitude modulation plate is set, and the amplitude modulation plate is driven by the eccentric roller, which can be realized. The eccentric roller pushes the amplitude modulation plate to move up and down, and then drives the probe to deform, so that the probe head of the probe moves from the detection position to the preparation position, or from the preparation position. to the detection position, and then adjust the number of probes at the detection position, so that the detection range of a single probe card can be adjusted, so that the probe card has versatility.

Description

technical field [0001] The invention belongs to the technical field of probe cards, in particular to an amplitude modulation probe card and its probe and amplitude modulation structure. Background technique [0002] With the development of the semiconductor industry, more and more electronic devices are connected to the semiconductor wafer. During the manufacturing process of the semiconductor device, the probe is contacted with the metal end on the semiconductor wafer to realize a temporary electrical connection. The electrical signal of the tester is transmitted to the semiconductor device through the probe, and the tester detects the electronic device on the semiconductor wafer through the returned electrical signal. [0003] The probe card is the link between the semiconductor wafer and the tester. By integrating multiple probes on the probe card, multiple probes can be simultaneously contacted with multiple semiconductor devices on the semiconductor wafer to improve det...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R1/073
CPCG01R31/2887G01R1/07314G01R1/07342G01R31/2889G01R1/20
Inventor 王艾琳赵梁玉
Owner MAXONE SEMICON CO LTD