Unlock instant, AI-driven research and patent intelligence for your innovation.

Gas replacement device and photoresist baking equipment

A technology of baking equipment and gas replacement, which is used in opto-mechanical equipment, microlithography exposure equipment, photo-engraving process coating equipment, etc. problem, to achieve the effect of speeding up, reducing pressure, and increasing flow rate

Active Publication Date: 2021-03-19
晶芯成(北京)科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

like figure 1 As shown, due to the poisoning of the photoresist layer, the pattern accuracy of the photoresist layer is reduced, so the pattern formed on the semiconductor layer using it as a mask is prone to defects such as over-etching, and the pattern accuracy is seriously affected.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Gas replacement device and photoresist baking equipment
  • Gas replacement device and photoresist baking equipment
  • Gas replacement device and photoresist baking equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The gas replacement device and photoresist baking equipment proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0038]This embodiment provides a gas replacement device, including an air intake plate and an exhaust plate oppositely arranged, the air intake plate is provided with a plurality of first air inlets facing the exhaust plate, and the exhaust plate A plurality of exhaust ports distributed in rows and columns are arranged on the plate opposite to the air intake plate, and first exhaust passages corresponding to the exhaust ports one-to-one are arranged...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a gas replacement device and photoresist baking equipment. The gas replacement device has a relative intake plate and an exhaust plate, and a plurality of first air inlets and a plurality of exhaust ports are respectively arranged on the opposite plates, and the exhaust plate is provided with a Corresponding first exhaust passages and a plurality of second exhaust passages communicated with the first exhaust passages of each column respectively, one end of the second exhaust passages is a second air inlet, and the second exhaust passages include a plurality of first exhaust passages One section and a second section, the second section is located between two adjacent first sections, the first exhaust passage communicates with the second section, at least part of the cross-sectional area of ​​the second section is smaller than that of the first section. The gas replacement device can quickly replace and discharge the gas between the intake plate and the exhaust plate. The photoresist baking equipment includes the gas replacement device, which quickly replaces the gas when the baking cavity is opened, which helps to solve the photoresist poisoning phenomenon caused by the accumulation of photoresist baking volatiles.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a gas replacement device and a photoresist baking equipment including the gas replacement device. Background technique [0002] In current semiconductor manufacturing, photoresist is usually coated on a substrate such as a silicon wafer, and then the photoresist layer is exposed and developed to form a patterned photoresist layer, and then the patterned photoresist layer is used as a mask The substrate is etched to transfer the patterns on the patterned photoresist layer to the substrate. Before and after exposure, the photoresist layer usually needs to be baked. [0003] However, during the baking process, the photoresist will release some volatile gas, which needs to be discharged from the baking cavity in time, otherwise the residual gas will have an adverse effect on the subsequent process. For example, when using the same cavity to bake different types o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/16G03F7/38G03F7/40G03F7/20
CPCG03F7/168G03F7/38G03F7/40G03F7/70916
Inventor 吴宣秦典昇
Owner 晶芯成(北京)科技有限公司