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Multi-layered ceramic capacitor and method of manufacturing the same

A technology of multilayer ceramics and capacitors, applied in the direction of multilayer capacitors, fixed capacitor electrodes, fixed capacitor dielectrics, etc., can solve the problems of sintered density decrease, moisture-proof reliability deterioration, reliability deterioration and other problems

Active Publication Date: 2020-12-22
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, in the case of the above method, in the operation of forming the side edge portion, a large number of voids are generated at the interface where the ceramic main body and the side edge portion contact each other , and a large number of voids will degrade reliability
[0008] In addition, due to the porosity, moisture-proof reliability may be deteriorated due to decrease in sintered density of the outer portion

Method used

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  • Multi-layered ceramic capacitor and method of manufacturing the same
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  • Multi-layered ceramic capacitor and method of manufacturing the same

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Embodiment Construction

[0024] Hereinafter, preferred embodiments of the present disclosure will be described with reference to the accompanying drawings. The embodiments of the present disclosure may be modified into various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Embodiments of the present disclosure are also provided in order to more fully describe the present disclosure to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be exaggerated for clarity, and elements denoted by the same reference numerals are the same elements in the drawings.

[0025] figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to an embodiment of the present disclosure.

[0026] figure 2 is showing figure 1 Perspective view of the ceramic body and side edge parts.

[0027] image 3 is showing figure 2 A perspective view of the ceramic green sheet stack before the sintering ope...

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Abstract

The invention provides a multi-layered ceramic capacitor and a method of manufacturing the same. According to an embodiment of the present invention, the multilayer ceramic capacitor comprises: a ceramic body including a dielectric layer and a plurality of internal electrodes disposed in the ceramic body; and a first side margin portion and a second side margin portion disposed on a first surfaceand a second surface, allowing the internal electrodes to be exposed, of the ceramic body. The first and second side margin portions respectively comprise a first area adjacent to the side surface outwards the face of the corresponding side margin portion and a second area adjacent to the internal electrodes exposed to the first and second surfaces of the ceramic body. The average size of dielectric grains included in the second area is larger than that of dielectric grains included in the first area.

Description

[0001] This application claims the benefit of priority of Korean Patent Application No. 10-2019-0073887 filed with the Korean Intellectual Property Office on June 21, 2019, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to a multilayer ceramic capacitor capable of improving reliability and a method of manufacturing the multilayer ceramic capacitor. Background technique [0003] In general, electronic components using ceramic materials such as capacitors, inductors, piezoelectric elements, varistors, thermistors, etc. may include a ceramic body made of ceramic material, internal electrodes formed in the ceramic body, and a set On the surface of the ceramic body to connect the external electrodes to the internal electrodes. [0004] In recent years, miniaturization and multifunctionalization of electronic products have led to a trend toward miniaturization and high functionality of chip compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/12H01G4/002
CPCH01G4/30H01G4/12H01G4/002H01G4/012H01G4/1218H01G4/224H01G4/1209H01G4/1227H01G2/02H01G4/008
Inventor 李种晧朴龙洪奇杓姜心忠
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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