Sandwich type polyimide composite film, preparation method and application thereof
A polyimide flat film, polyimide technology, applied in the coating and other directions, can solve the problems of complex steps, water resistance or mechanical property damage, expensive raw materials, etc., to achieve mechanical properties maintenance, water resistance improvement, The effect of reducing the dielectric constant
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Embodiment 1
[0043] The organic phase was prepared by dissolving 6 mg of polyimide, 0.06 mg of dodecyl trimethyl ammonium bromide and 0.27 mg of octamethyl-POSS in 5 mL of chloroform at the same time. This organic phase was mixed with 60 μL of deionized water and sonicated for 10 min. Prepare microemulsion, pour 200 μL of this microemulsion on 20 cm at 30°C and 35% humidity 2 The upper and lower surfaces of the polyimide flat film are first poured on one surface, left for about 2 minutes, and then turned over and poured on the other surface. After the deionized water and chloroform are completely evaporated, a sandwich type is prepared. Polyimide composite film containing POSS porous structure.
[0044] figure 1 It is the scanning electron microscope picture of the porous structure in the sandwich-type polyimide composite film prepared in this example. figure 1 It can be seen that the pores in the porous structure are arranged in a close hexagonal packing, showing a structure similar to ...
Embodiment 2
[0049] Same as Example 1, other substance concentrations, temperature and humidity conditions remain unchanged, the amount of octamethyl-POSS is reduced to 0.6 mg, and the above steps are repeated to prepare a sandwich-type polyimide composite film. The average hole diameter in the composite film obtained in this example is about 2.4 μm, the dielectric constant of the composite film is 2.42, which is 27.73% lower than that of the polyimide flat film, and the water absorption rate is 0.615%, which is higher than that of the polyimide flat film. It has decreased by 78%, and the tensile strength is 98.65MPa, which is 3.24% higher than that of the polyimide flat film. After being placed in an environment with a humidity of 75% for 25 hours, the dielectric constant of the composite film is only 2.48, an increase of 2.35 %.
Embodiment 3
[0051] The same as in Example 1, the concentration of other substances and the conditions of temperature and humidity remain unchanged, the amount of octamethyl-POSS is reduced to 1.2 mg, and the above steps are repeated to prepare a sandwich-type polyimide composite film. The average hole diameter in the obtained composite film is about 2.6 μm, the dielectric constant of the composite film is 2.35, which is 29.95% lower than that of the polyimide flat film, and the water absorption rate is 0.592%, which is 78.82% lower than that of the polyimide flat film. %, the tensile strength is 96.99MPa, which is 1.51% higher than that of the polyimide flat film. After being placed in an environment with a humidity of 75% for 25 hours, the dielectric constant of the composite film is only 2.40, an increase of 2.04%.
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