High-integration brick type TR assembly

A high-integration, component technology, applied in the fields of radar, telemetry and communication, can solve the problems of high cost of TR components, poor consistency of batch production indicators, and large differences in channel indicators, so as to achieve quick and convenient debugging and improve batch production consistency. Sex, the effect of reducing the amount of use

Active Publication Date: 2020-12-29
SICHUAN SIAIPU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, traditional TR components usually integrate a small number of channels, and the function of the channel chip is relatively single, resulting in high cost of TR components, low degree of integration, and poor consistency of batch production indicators.
[0003] At present, the multi-channel integration of TR components is mainly limited by the relatively single function of the chip, and the number of chips used in a single channel of the component is large.
As a result, during multi-channel integration, the indicators of each channel are quite different, the consistency of batch production indicators is poor, the workload of debugging is large, and the volume has no obvious advantages compared with traditional TR components. The above factors are the main reasons why TR components cannot be highly integrated.

Method used

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  • High-integration brick type TR assembly
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Embodiment Construction

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but the embodiments described in the present invention are some of the embodiments of the present invention, not all of them .

[0038] It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

[0039] In describing the present invention, it should be noted that the terms "centre", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. indicate The orientation or positional relationship of the invention is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually p...

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Abstract

The invention provides a high-integration brick type TR assembly. The high-integration brick type TR assembly comprises a shell, a radio frequency circuit board, an inner cover plate and an outer cover plate, wherein an installation cavity is formed in one end surface of the shell, a radio frequency output end connector and a low-frequency connector are arranged on one side wall of the installation cavity in a penetrating way, radio frequency antenna end connectors are arranged on the opposite side wall of the installation cavity in a penetrating way, and 24 radio frequency antenna end connectors are arranged; the radio frequency circuit board is arranged in the installation cavity, radio frequency and digital components are arranged on the front surface of the radio frequency circuit board, radio frequency microstrip lines are arranged on the back surface of the radio frequency circuit board, the radio frequency microstrip lines on the front surface and the back surface are connectedby a printed board vertical interconnection through hole, the radio frequency output end connector, the low-frequency connector and the radio frequency antenna end connectors are all connected to theradio frequency circuit board, and the radio frequency circuit board is provided with multifunctional chips and power supply modulation modules corresponding to the radio frequency antenna end connectors; a shielding cavity is formed in the bottom surface of the inner cover plate, the inner cover plate is arranged on the radio frequency circuit board, and the multifunctional chips are arranged inthe shielding cavity; and the outer cover plate is used for sealing the installation cavity. By a multi-channel integrated design, the volume of the brick type TR assembly is reduced, the sealing performance is better, and detection and debugging are facilitated.

Description

technical field [0001] The invention belongs to the technical fields of radar, telemetry and communication, and in particular relates to a highly integrated brick-type TR assembly. Background technique [0002] With the development of the times, active phased array radar has been more and more widely used due to its unique performance indicators, high integration and weight advantages, and has a tendency to completely replace traditional radar. The TR component is the core component of the active phased array radar, and its performance index and volume directly determine the performance of the active phased array radar equipment. Based on this, under the premise of ensuring the electrical performance index, TR components are gradually developing towards miniaturization and integration. At present, traditional TR components usually integrate a small number of channels, and the function of the channel chip is relatively single, resulting in high cost of TR components, low deg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01S7/02G01R31/28G01R31/52G01R31/58
CPCG01R31/2822G01S7/02G01R31/52G01R31/58G01S7/028
Inventor 巫长海罗亮
Owner SICHUAN SIAIPU ELECTRONICS TECH CO LTD
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