A test device for a carrier-type bare-chip power amplifier module

A technology of a power amplifier module and a test device, which is applied to measurement devices, measurement device casings, radio frequency circuit testing, etc., can solve the problems of difficult electrical performance index testing, small circuit structure space, and fragile surface bare chips, so as to avoid surface chip damage. Risk, ensure reliability, and test the effect of low cost

Active Publication Date: 2021-02-12
SICHUAN SIAIPU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the special structure of the carrier-type bare chip power amplifier module, the bare chip on the surface is extremely fragile and easily damaged, and the circuit structure space is small, so the electrical performance index test of this type of module is a difficult problem

Method used

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  • A test device for a carrier-type bare-chip power amplifier module
  • A test device for a carrier-type bare-chip power amplifier module
  • A test device for a carrier-type bare-chip power amplifier module

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Embodiment Construction

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but the embodiments described in the present invention are some of the embodiments of the present invention, not all of them .

[0037] It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

[0038] In describing the present invention, it should be noted that the terms "centre", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. indicate The orientation or positional relationship of the invention is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually p...

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Abstract

A carrier-type bare chip power amplifier module testing device, comprising a slide rail support block, the top surface of the slide rail support block is connected with a base block, the end of the base block is connected with a lock nut, the lock nut is threadedly connected with a pull rod, and the end of the pull rod rotates The wedge-shaped slider is connected, and the wedge-shaped slider is matched with a bracket; the low-frequency probe board includes a probe seat, which is connected to a low-frequency control board, and the low-frequency control board is inserted with a multi-core connector, and the multi-core connector is welded with a low-frequency The other end of the low-frequency transfer line is connected with an elastic probe; the surface of the first radio frequency circuit board is provided with a first radio frequency transmission line, and the surface of the second radio frequency circuit board is provided with a second radio frequency transmission line; the radio frequency elastic probe assembly and the second radio frequency circuit Board matching; RF coaxial components are horizontally installed on the base block. The invention adopts a novel structural design to realize fast clamping of the power amplifier module, and solves the problem of testing the electrical performance index of the power amplifier module.

Description

technical field [0001] The invention relates to the technical field of power amplifier module detection, in particular to a test device for a carrier-type bare chip power amplifier module. Background technique [0002] With the development of the times, the volume of radio frequency microwave circuits is getting smaller and smaller, and the power density is getting higher and higher. To cope with this trend, the application of carrier board bare chip power amplifier modules in radio frequency microwave circuits is becoming more and more extensive. Due to the special structure of the carrier board bare chip power amplifier module, the bare chip on the surface is extremely fragile and easily damaged, and the circuit structure space is small, so the electrical performance index test of this type of module is a difficult problem. Contents of the invention [0003] Aiming at the problems existing in the related prior art, the present invention provides a carrier-type bare-chip ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R1/04G01R1/067
CPCG01R1/0408G01R1/0425G01R1/067G01R31/2822
Inventor 罗亮肖磊魏艾莉
Owner SICHUAN SIAIPU ELECTRONICS TECH CO LTD
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