Sampling defect detection method, sampling defect detection equipment and sampling defect detection system
A defect detection and inspection station technology, applied in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as wafer passing, and achieve reasonable defect detection results
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no. 1 example
[0062] For example, there are 3 machines in the TR HARD MASK etching site, the machine IDs are TOOL01, TOOL02, and TOOL03, and each machine has only one cavity. At present, the 3 machines at this site have processed a total of 12 batches of wafer groups. Table 1 below shows the sampling data corresponding to multiple machines and one cavity.
[0063] Table 1 Sampling data corresponding to multiple machines and one cavity
[0064]
[0065] Assume that the wafer groups whose end numbers are 1, 3, 5, 6, and 8 combined with the sampling defect detection rules are the wafers to be sampled for defect detection (corresponding to the underlined numbers in the table), from the above table It can be seen that TOOL02 has not been randomly inspected during this period of time, and correspondingly, each wafer in the wafer group with the tail numbers of wafer group 2, 4, 7, and 12 has not been randomly inspected either.
no. 2 example
[0067] For example, there is a machine TOOL at the TR HARD MASK etching site, and the corresponding chambers of the machine are TOOLCA, TOOLCB, and TOOLCC. Currently, the three chambers of the machine at this site run a batch of wafer groups. There are 25 wafers in the wafer group, as shown in Table 2, the sampling data corresponding to one or more machines with multiple chambers.
[0068] Table 2 Sampling data corresponding to one or more machines and multiple chambers
[0069]
[0070] Combined with the sampling defect detection rules, the wafers with serial numbers #1, #8, and #18 in the wafer group are the wafers to be sampled for defect detection. It can be seen from the above table that TOOLCB Not checked.
[0071] It should be noted that the situation of one multi-chamber machine in a process site is essentially the same as that of multiple multi-chamber machines, and they must be specific to the level of the chamber. The second embodiment and Table 2 only take one...
no. 3 example
[0073]For example, there are 3 machines in the TR HARD MASK etching site, and the machine IDs are: TOOL01, TOOL02, and TOOL03. The corresponding cavities of TOOL01 are TOOL01CA, TOOL01CB, TOOL01CC; the corresponding cavities of TOOL02 are: TOOL02CA, TOOL02CB; the corresponding cavities of TOOL03 are TOOL03CA. At present, the 3 machines at this site have run a total of 12 batches of wafer groups, and each batch of wafers has a lot of 25 wafers. It should be noted that the difference between the third embodiment and the second embodiment is that among the multiple machines included in the process station in the third embodiment, there are both machines that contain multiple cavities, and some that contain only one Cavity machines, because the processing methods corresponding to one cavity or multiple cavities are different, so the subsequent processing of this situation is slightly more complicated than the multiple multi-cavity machines involved in the second embodiment . Tab...
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