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Printed circuit board detection method based on X-ray layering technology

A technology of printed circuit board and layering technology, applied in the field of testing equipment, can solve problems such as cost and multi-processing time, and achieve the effect of improving picture quality

Pending Publication Date: 2021-01-08
FOSHAN NANHAI GUANGDONG TECH UNIV CNC EQUIP COOP INNOVATION INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of X-ray images provides a way to solve this problem. Traditional transmission X-ray images can generally provide some clues to defects. In order to provide more reliable and accurate defect information, X-ray computed tomography can be used to detect internal defects. and provide reconstructed 3D images, however, X-ray computed tomography takes more processing time than traditional transmission X-ray inspections, and even a single image for a certain plane typically requires hundreds of images to reconstruct a good the result of

Method used

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  • Printed circuit board detection method based on X-ray layering technology
  • Printed circuit board detection method based on X-ray layering technology
  • Printed circuit board detection method based on X-ray layering technology

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Embodiment approach

[0037] As a preferred embodiment of the present invention, the step S5 specifically includes:

[0038] The correlation coefficient CC was determined using the following equation:

[0039]

[0040]

[0041]

[0042] where f s (x,y) and f T (x, y) are the gray levels of the reference image and the reconstructed image at a given image position (x, y), respectively, μ s and μ T is the average gray value of the reference image and the reconstructed image; and are the grayscale variances of the reference image and the reconstructed image, respectively.

[0043] Compared with prior art, the beneficial effect of the present invention is:

[0044] The beneficial effect of a printed circuit board detection method based on X-ray layering technology provided by the present invention is that the purpose of this study is to optimize the X-ray tomography technology for printed circuit board detection, and the system parameters studied include motion The type, the number of ...

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Abstract

The invention discloses a printed circuit board detection method based on an X-ray layering technology. The method comprises the following steps: S1, determining a research object; S2, judging whetherthe motion type of the research object is a translation type or a rotation type; S3, if the motion type of the research object is a translation type, improving picture quality by specifying a wire direction; S4, if the motion type of the research object is a rotation type, improving the picture quality by increasing the number of a synthesized image; and S5, taking a correlation coefficient CC asan index of image similarity. The printed circuit board detection method based on the X-ray layering technology provided by the invention has the beneficial effects that the study aims at optimizingX-ray tomography technology for printed circuit board detection; wherein studied system parameters comprise a motion type, a synthetic image number and a projection angle of an x-ray source, and a correlation coefficient is used as a test index.

Description

technical field [0001] The invention relates to the technical field of detection equipment, in particular to a printed circuit board detection method based on X-ray layering technology. Background technique [0002] For printed circuit boards, visual inspection is often used to detect board substrate damage, missing, misplaced or damaged components, soldering failures, and similar quality defects that are visible to the naked eye. Automated optical inspection systems are being refined to automate these inspections in an increasing number of installations. These automated optical inspection systems can then only detect defects that appear on the surface of the inspected object, making them useless for internal defects or defects hidden behind other objects. The use of X-ray images provides a way to solve this problem. Traditional transmission X-ray images can generally provide some clues to defects. In order to provide more reliable and accurate defect information, X-ray com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T11/00G06K9/62
CPCG06T7/0004G06T11/003G06T2207/10081G06T2207/30141G06T2207/30168G06F18/22
Inventor 王华龙朱涛杨海东宋秋云
Owner FOSHAN NANHAI GUANGDONG TECH UNIV CNC EQUIP COOP INNOVATION INST
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