Semiconductor device packaging structure and semiconductor device packaging method
A device packaging and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, semiconductor/solid-state device manufacturing, etc., can solve the problems of high reliability of packaging structure, achieve high packaging efficiency, precise control, and overcome excessive solder fillet high effect
Pending Publication Date: 2021-01-08
GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
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[0004] An object of the embodiments of the present invention is to provide a semiconductor device packaging structure, which can more accurately control the thickness of the graphene bonded film, and can overcome the problems caused by excessively high solder angles, and the reliability of the packaging structure is high.
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[0038] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work all belong to the protection scope of the present invention.
[0039] In the description of the present invention, unless otherwise clearly stipulated and limited, the terms "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection or an integral body; it can be a mechanical connection , can also be an electrical connection; it can be a direct ...
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Abstract
The invention discloses a semiconductor device packaging structure and a semiconductor device packaging method. The packaging structure comprises: a semiconductor tube core, wherein the first end of the semiconductor tube core is provided with a front electrode, the second end of the semiconductor tube core is provided with a back electrode, and the first end is opposite to the second end; a graphene binding film; a packaging container which comprises a connecting plate and a side wall plate, wherein the side wall plate extends from the connecting plate and is bent, so that a packaging space is defined by the side wall plate and the connecting plate, the side wall plate comprises an outer leading end, the semiconductor tube core is arranged in the packaging space, and the second end of thesemiconductor tube core, the graphene combination film and the connecting plate are combined in sequence, and the back electrode is electrically connected with the outer leading end through the graphene bonding film and the connecting plate in sequence. In the packaging method, the semiconductor die is connected with the packaging container through the graphene bonding film. According to the invention, the thickness of the graphene bonding film can be more accurately controlled, the problems caused by too high welding corners can be overcome, and the packaging structure is high in reliabilityand high in packaging efficiency.
Description
technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor device packaging structure and a semiconductor device packaging method. Background technique [0002] At present, in order to improve the heat dissipation performance of semiconductor devices, the semiconductor die is packaged in a cup-shaped packaging container to form a packaging structure, and the back of the semiconductor die is electrically connected to the packaging container through a conductive bonding material (such as conductive silver glue). The back electrode on the back of the semiconductor die is led out through the packaging container, and the heat dissipation performance of this packaging structure is good; in the packaging process of this packaging structure, it is necessary to control the thickness of the conductive bonding layer formed between the semiconductor die and the packaging container Within an appropriate range to ensure...
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IPC IPC(8): H01L23/367H01L23/373H01L23/06H01L21/52
CPCH01L23/373H01L23/3677H01L23/3675H01L23/3736H01L23/3733H01L23/06H01L21/52
Inventor 王琇如唐和明
Owner GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD