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Circuit board cooling device

A cooling device and circuit board technology, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve problems such as large installation space and affecting production efficiency, achieve compact structure and improve installation efficiency , The effect of saving installation space

Inactive Publication Date: 2021-01-12
HANGZHOU CHANGCHUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This not only takes up a large installation space, but also affects production efficiency

Method used

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  • Circuit board cooling device
  • Circuit board cooling device
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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0026] It should be noted that when a component is said to be "mounted on" another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "set on" another component, it may be set directly on the other component or there may be an intervening component at the same time. When a component is said to be "fixed" to another component, it may be directly fixed to the other component or there may be an intervening component at the same time. The terms "vertical," "horizontal," "left...

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Abstract

The invention relates to a circuit board cooling device which is used for cooling a circuit board, the circuit board cooling device comprises at least two cooling modules and a shunt, the cooling modules are attached to the circuit board and used for containing cooling liquid and cooling the circuit board, the shunt is provided with at least two groups of shunt interfaces, wherein each group of shunting interfaces is correspondingly connected to the cooling module, and the shunt is communicated with the cooling module through the shunting interfaces. According to the circuit board cooling device, the shunt is arranged, and the plurality of cooling modules which are modularly combined are connected to the shunt. Therefore, the circuit board cooling device can efficiently control the temperature of a plurality of circuit boards, the structure of the circuit board cooling device is compact, the installation space in electronic equipment is saved, and the installation efficiency of the circuit board cooling device is correspondingly improved.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a circuit board cooling device. Background technique [0002] In current electronic equipment, multiple high-power chips are integrated on the same circuit board to form a powerful high-power circuit board. However, highly integrated circuit boards are prone to heat dissipation problems. [0003] In the traditional heat dissipation method, one circuit board is usually installed correspondingly to one cooling device, and electronic equipment installed with multiple circuit boards usually needs to use multiple cooling devices to achieve better heat dissipation effect. This not only takes up a large installation space, but also affects production efficiency. Contents of the invention [0004] Based on this, it is necessary to provide an improved circuit board cooling device for the above-mentioned problems, by providing a flow divider and connecting a plurality of m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272H05K7/20281
Inventor 吴柯琦盛伟峰程高飞
Owner HANGZHOU CHANGCHUAN TECH CO LTD
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