Temperature-adjustable refrigerating device and heat dissipation support of metal-body notebook computer

Abstract

The invention discloses a temperature-adjustable refrigeration device and a heat dissipation support of a metal-body notebook computer. The temperature-adjustable refrigeration device comprises a semiconductor refrigeration sheet, a cold conduction metal sheet, wherein the lower surface of the cold conduction metal sheet is tightly attached to the cold effect surface of the semiconductor refrigeration sheet through a cold conduction bonding layer; a temperature control circuit board which can control refrigeration power of the semiconductor refrigeration sheet; and a heat dissipation metal structure body, wherein the upper surface of the heat dissipation metal structure body is a plane, and the heat dissipation metal structure body is tightly attached to the heat effect face of the semiconductor refrigeration plate through a heat conduction bonding layer. The invention has the beneficial effects that heat of the heat effect surface of the semiconductor refrigeration plate is rapidly taken away through the heat dissipation metal structure body, so that the maximum refrigerating capacity can be output, meanwhile, the output power can be adjusted through the temperature control circuit board, and the temperature of the cold conduction surface can be adjusted. The invention further provides the heat dissipation support of the metal-body notebook computer applying the temperature-adjustable refrigerating device.

Description

technical field [0001] The invention relates to the fields of refrigeration equipment and notebook cooling brackets, in particular to a notebook cooling bracket with a metal body. Background technique [0002] In recent years, more and more notebook computers use metal body. Due to the size limitation, most of them omit the heat dissipation air inlet at the bottom of the body, and only design the heat dissipation air vent on the side. The whole body relies on its own metal body to conduct heat conduction in the air. Heat dissipation. At present, the general-purpose notebook radiators on the market generally adopt the form of air cooling to blow heat from bottom to top. In this heat dissipation mode, the air can only be blown to the notebook body and cannot be blown into the interior of the fuselage. Therefore, the air-cooled equipment can only be reduced by 3 -5 degrees. Moreover, most notebook cooling supports are fixed in height, and the height and angle cannot be adjust...

AI Technical Summary

Problems solved by technology

However, the existing semiconductor cooling chips have little cooling effect when used in a single chip, and the cooling power cannot be adjusted, so they cannot be intelligently applied to the heat dissipation adjustment of notebooks under different heating conditions.

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