Integrated circuit board based on V-shaped groove heat dissipation
An integrated circuit board, V-groove technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of hot and hot circuit boards, affecting the service life of circuit boards, and different working environments of circuit boards.
Pending Publication Date: 2021-01-15
胜伟策电子(江苏)有限公司
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Problems solved by technology
[0003] Traditional integrated circuit boards tend to become hot and hot during use, which often affects the service life of the circuit board and affects its normal operation. The working environment of the circuit board is different, and different environments have greater impact on the circuit board. Therefore, we propose an integrated circuit board based on V-groove heat dissipation to solve the above problems
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[0020]The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0021]SeeFigure 1-Figure 4, The present invention provides an integrated circuit board based on V-groove heat dissipation, including a storage box 1, a gas pipe 2 is fixedly connected to the inside of the storage box 1, a circuit board 3 is movably connected to the top of the gas pipe 2, and the top of the gas pipe 2 is fixedly connected to The gas collecting tank 4 is fixedly connected to the outside of the gas collecting tank 4 with a gas cyl...
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The invention discloses an integrated circuit board based on V-shaped groove heat dissipation. The integrated circuit board comprises a placement box, the interior of the placement box is fixedly connected with an air pipe, the top end of the air pipe is movably connected with a circuit board, the top end of the air pipe is fixedly connected with an air collection groove, the outer side of the aircollection groove is fixedly connected with an air storage bottle, an air valve is rotatably connected with the inner wall of the air storage bottle, a piston rod is fixedly connected with the lowerportion of the mounting block, an extrusion plate is fixedly connected with the upper portion of the mounting block, a connecting rod is fixedly connected with the bottom end of the extrusion plate, and air is sucked into the air storage bottle in a drawing mode and then injected into the air collection groove in a pushing mode. When the piston rod is lifted upwards, the air valve is opened to enable air to enter an air chamber from an air port, when the piston rod is pressed downwards, the air valve is closed to compress the air, the compressed air forms high-pressure airflow to enter the aircollection groove and then is exhausted through the air pipe, and the V-shaped groove is placed above the air pipe to conduct heat dissipation on a circuit board in the V-shaped groove.
Description
Technical field[0001]The invention belongs to the technical field of integrated circuit boards, and specifically relates to an integrated circuit board based on V-groove heat dissipation.Background technique[0002]The integrated circuit board adopts the semiconductor manufacturing process. Many transistors, resistors, capacitors and other components are fabricated on a small single crystal silicon chip, and the components are combined into a complete device according to the method of multilayer wiring or tunnel wiring. electronic circuit.[0003]Traditional integrated circuit boards often have the phenomenon of hot and hot circuit boards during use, which often affects the service life of the circuit boards and affects their normal operation. The working environment of the circuit boards is different, and different environments have more impact on the circuit boards. Because of this, we have proposed an integrated circuit board based on V-groove heat dissipation to solve the above prob...
Claims
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IPC IPC(8): H01L23/367H01L23/467H01L23/02
CPCH01L23/02H01L23/367H01L23/467
Inventor 尹苏敏叶陆圣游清远
Owner 胜伟策电子(江苏)有限公司