Substrate drying device

A drying device and substrate technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of reduced drying efficiency, complex overall structure of the device, and pattern collapse, so as to prevent loss, improve drying efficiency, and prolong use. The effect of longevity

Pending Publication Date: 2021-01-19
MUJIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, according to conventional techniques for drying wafers such as figure 1 As shown, there is a problem that during the drying process, the pattern formed on the wafer collapses due to the surface tension of the liquid i.e. I

Method used

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  • Substrate drying device
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Embodiment Construction

[0062]Since the specific structure or function descriptions of the embodiments according to the inventive concept disclosed herein are only exemplary for describing the embodiments according to the inventive concept, the embodiments according to the inventive concept may be embodied in various forms, But it is not limited to the embodiments described herein.

[0063]Although the embodiments of the present invention are susceptible to various modifications and alternative forms, specific embodiments thereof are shown by examples in the accompanying drawings and will be described in detail herein. However, it should be understood that there is no intention to limit the present invention to the specific forms disclosed, but on the contrary, the present invention will cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention.

[0064]It will be understood that, although the terms “first”, “second”, etc. may be used herein to describe v...

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Abstract

The present invention relates to a substrate drying apparatus, comprising: a chamber; a supercritical fluid generation and storage unit that generates and stores a supercritical fluid to be supplied into the chamber; and a supercritical fluid supply adjustment unit that adjusts the supercritical fluid to be supplied to the chamber stored in the supercritical fluid generation and storage unit, wherein the chamber includes: an upper housing; a lower housing; a substrate placing plate on which the substrate on which the organic solvent is formed is arranged; an upper supply port formed to face the substrate placement plate in a central region of the lower case and providing a supply path of a supercritical fluid for drying; and an integrated supply and discharge port extending from a side surface of the lower case to the center region and formed to face the substrate placement plate in the center region of the lower case, and a supply path for the supercritical fluid for initial pressurization and a discharge path for a mixed fluid in which an organic solvent is dissolved in the supercritical fluid for drying after drying is performed using the supercritical fluid for drying.

Description

Technical field[0001]The invention relates to a substrate drying device. More specifically, the present invention relates to a substrate drying device, in which a supercritical fluid is supplied to a drying chamber under the same conditions and a certain pressurization speed for each process, which can improve the use of supercritical fluids. The drying efficiency of the fluid on the substrate; by installing an orifice (the orifice that constantly buffers the flow of the supercritical fluid when the supercritical fluid is supplied to the drying chamber) at the front end of the metering valve of the supply line, the flow rate can be prevented from being adjusted The flow rate of the metering valve fluctuates to provide the supercritical fluid pressurization speed under the same conditions for each process; by preventing damage to the metering valve due to the high differential pressure generated in the metering valve during rapid pressurization, The service life of the valve can be p...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67034H01L21/67253H01L21/67098H01L21/67126H01L21/683
Inventor 申熙镛李泰京尹炳文
Owner MUJIN ELECTRONICS CO LTD
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