Substrate drying device

Abstract

The present invention relates to a substrate drying apparatus, comprising: a chamber; a supercritical fluid generation and storage unit that generates and stores a supercritical fluid to be supplied into the chamber; and a supercritical fluid supply adjustment unit that adjusts the supercritical fluid to be supplied to the chamber stored in the supercritical fluid generation and storage unit, wherein the chamber includes: an upper housing; a lower housing; a substrate placing plate on which the substrate on which the organic solvent is formed is arranged; an upper supply port formed to face the substrate placement plate in a central region of the lower case and providing a supply path of a supercritical fluid for drying; and an integrated supply and discharge port extending from a side surface of the lower case to the center region and formed to face the substrate placement plate in the center region of the lower case, and a supply path for the supercritical fluid for initial pressurization and a discharge path for a mixed fluid in which an organic solvent is dissolved in the supercritical fluid for drying after drying is performed using the supercritical fluid for drying.

Description

Technical field[0001]The invention relates to a substrate drying device. More specifically, the present invention relates to a substrate drying device, in which a supercritical fluid is supplied to a drying chamber under the same conditions and a certain pressurization speed for each process, which can improve the use of supercritical fluids. The drying efficiency of the fluid on the substrate; by installing an orifice (the orifice that constantly buffers the flow of the supercritical fluid when the supercritical fluid is supplied to the drying chamber) at the front end of the metering valve of the supply line, the flow rate can be prevented from being adjusted The flow rate of the metering valve fluctuates to provide the supercritical fluid pressurization speed under the same conditions for each process; by preventing damage to the metering valve due to the high differential pressure generated in the metering valve during rapid pressurization, The service life of the valve can be p...

AI Technical Summary

Problems solved by technology

[0005] However, according to conventional techniques for drying wafers such as figure 1 As shown, there is a problem that during the drying process, the pattern formed on the wafer collapses due to the surface tension of the liquid i.e. IPA

Therefore, there is a problem in that the overall structure of the device is complicated

Therefore, it is difficult to uniformly disperse supercritical fluid into the chamber for supply and discharge, resulting in reduced drying efficiency

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