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Circuit structure

A circuit structure and circuit board technology, applied in circuits, printed circuits, printed circuits, etc., can solve the problems that affect the miniaturization of integrated circuit modules, affect the efficiency of wire bonding, and increase the amount of wire bonding, so as to improve the efficiency of wire bonding and wiring. The effect of dot arrangement density and dosage reduction

Inactive Publication Date: 2021-01-26
GUANGZHOU LUXVISIONS INNOVATION TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above method not only needs to use more amount of wire bonding, but also affects the wire bonding efficiency due to the longer wire bonding distance.
In addition, since each pad needs to be directly connected to the common connection pad by bonding, the number of bonding wires per unit space is more arranged, which makes the space utilization of the connection points of the integrated circuit insufficient, thereby affecting the integrated circuit. Module miniaturization

Method used

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  • Circuit structure
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Embodiment Construction

[0039] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0040] figure 1 is a schematic diagram of a circuit structure according to an embodiment of the present invention. Please refer to figure 1 , in this embodiment, the circuit structure 100a includes a pad component 110a, a connection pad component 120a and a connection component 130a. The pad assembly 110 a includes a first pad 112 , a second pad 114 and a third pad 116 separated from each other. The connection pad assembly 120 a is located on one side of the pad assembly 110 a and includes a first connection pad 122 . The connection assembly 130a includes a first bonding wire 132 , a second bonding wire 134 and a plurality of connecting elements 136a. The first bonding wire 132 connect...

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Abstract

The invention provides a circuit structure. The circuit structure comprises a connecting pad assembly, a connecting pad assembly and a connecting assembly. The connecting pad assembly comprises a first connecting pad, a second connecting pad and a third connecting pad which are separated from one another. The connecting pad assembly is located on one side of the connecting pad assembly and comprises a first connecting pad. The connecting assembly comprises a first bonding wire, a second bonding wire and a plurality of connecting pieces. The first bonding wire is connected with the first connecting pad and the first connecting pad. The second bonding wire is connected with the first connecting pad and the third connecting pad. The connecting pieces are connected among the first connecting pad, the second connecting pad and the third connecting pad. According to the circuit structure, the routing efficiency and the wiring point arrangement density can be improved, and the routing consumption can be reduced.

Description

technical field [0001] The invention relates to a circuit structure, in particular to a circuit structure capable of improving wire bonding efficiency. Background technique [0002] Generally speaking, the current wiring method of an integrated circuit is to connect each pad on the chip side with a common connection pad on the circuit board by wire bonding. That is, each bonding wire connects one pad and one common connection pad. The above method not only needs to use more amount of wire bonding, but also affects the wire bonding efficiency due to the longer wire bonding distance. In addition, because each pad needs to be directly connected to the common connection pad by bonding, the number of bonding wires in a unit space is more arranged, which makes the space utilization of the connection points of the integrated circuit insufficient, thereby affecting the integrated circuit. Module miniaturization. Contents of the invention [0003] The invention is aimed at a cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L23/495
CPCH01L23/49H01L23/49531H01L23/49517H01L2224/4813H01L2224/49433H01L2224/49113H01L2224/05554H05K2203/049H05K3/328H05K2201/0979H01L2224/45144H01L2224/45147H01L24/45H01L24/48H01L24/49H01L2224/4941H01L2224/06135H01L2224/04042H01L24/06H01L2224/48227H01L24/05H01L24/16H01L2224/1613H01L2224/85951H01L24/85H01L2224/48992H01L2224/13144H01L2224/13147H01L24/13H01L2924/00014H01L2224/0603H01L2224/06132H01L2224/4903H01L2224/4911H01L2224/49175H01L2224/49421H01L2924/01029H01L2924/01079H05K1/111H05K2201/094
Inventor 周安都骆冰峰
Owner GUANGZHOU LUXVISIONS INNOVATION TECH LTD