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Grounding mechanism for multi-layer for electrostatic chuck, and related methods

An electrostatic chuck, multi-layer structure technology, applied in the direction of circuit, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of wafer damage handling, non-uniformity, improper bonding of wafers, etc.

Pending Publication Date: 2021-01-29
ENTEGRIS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the associated robotic arm attempts to pick up the wafer, the arm may not engage the wafer properly and may accidentally push the wafer off the chuck, which may cause damage to the wafer and interruption of processing
[0005] Even if charge accumulation does not cause workpiece "sticking" problems, it may cause damage to microelectronic structures formed on the workpiece
In plasma-doped ion implanters where the workpiece is positioned in the same chamber as the plasma, excess charge buildup can also lead to doping non-uniformity, microloading and arcing
Therefore, in some cases it may be necessary to deliberately limit the throughput of the plasma-doped ion implanter to avoid excessive charge build-up

Method used

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  • Grounding mechanism for multi-layer for electrostatic chuck, and related methods
  • Grounding mechanism for multi-layer for electrostatic chuck, and related methods

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Embodiment Construction

[0016] The following detailed description should be read with reference to the accompanying drawings, in which like elements in different drawings are numbered the same. The detailed description and drawings are not necessarily to scale, depict illustrative embodiments, and are not intended to limit the scope of the invention. The illustrative embodiments depicted are intended to be exemplary only. Selected features of any illustrative embodiment may be incorporated into an additional embodiment unless expressly stated to the contrary.

[0017] As used in this specification and the appended claims, the singular forms "a (a)" and "the" include plural referents unless the content clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally intended to include "and / or" unless the content clearly dictates otherwise.

[0018] The term "about" generally refers to a range of numbers that are considered equivalent to the stated value ...

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Abstract

The application relates to a grounding mechanism for a multi-layer for an electrostatic chuck, and related methods. Described are multi-layer electrostatic chucks used to secure and support a wafer substrate during wafer processing, and related methods, wherein the chuck includes a grounding structure that includes a grounding layer and a grounding pin.

Description

technical field [0001] The present invention generally relates to electrostatic chucks for securing and supporting wafer substrates during wafer processing. Background technique [0002] Electrostatic chucks (also referred to simply as "chucks") are used in semiconductor wafer and microelectronic device processing. The chuck securely holds a workpiece, such as a semiconductor wafer or a microelectronic device substrate, in place for performing a process on the surface of the workpiece. The upper surface of the chuck, sometimes referred to as the "substrate support surface," may contain specialized features to improve the performance of the chuck. One such feature is a conductive coating, which can be used to provide an electrical connection between the workpiece and electrical ground. [0003] In one particular application, the conductive coating is effective in removing electrostatic charge from a workpiece, or preventing the build-up of electrostatic charge at the workpi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6833H01L21/68757H01L21/68785
Inventor S·唐奈J·莱辛斯基陈俊泓刘研
Owner ENTEGRIS INC