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Compensation method for keeping impedance continuity of wiring layer

A technology of impedance continuity and compensation method, which is applied in the direction of printed circuit making wiring diagram, computer design circuit, electrical components, etc., can solve the problem of discontinuous wiring impedance, etc., and achieve the effect of reliable design principle, simple structure and wide application prospect

Inactive Publication Date: 2021-01-29
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the pin pitch of the BGA chip is ≤0.5mm, the line width of the outgoing pin line will change from thin to thick, resulting in discontinuous line impedance in the BGA area. In the existing technology, the only way to shorten the line to be compensated The line width and length of the line make the length of the impedance discontinuity as short as possible, and the impedance discontinuity cannot be completely avoided

Method used

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  • Compensation method for keeping impedance continuity of wiring layer
  • Compensation method for keeping impedance continuity of wiring layer
  • Compensation method for keeping impedance continuity of wiring layer

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Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] figure 1 is a schematic flowchart of a method in one embodiment of the present invention. Such as figure 1 As shown, the method includes:

[0031] Step 110, creating a compensation section on the trace level that needs to be compensated, and calculating the area of ​​the compensation section;

[0032] Step 120, adding a V-shaped gro...

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Abstract

The invention provides a compensation method for keeping impedance continuity of a wiring layer. The method comprises the following steps of creating a compensation section on the wiring layer to be compensated, and calculating an area of a compensation section; additionally forming a V-shaped groove in a compensation layer surface, wherein the area of the cross section of the V-shaped groove is equal to that of the compensation section; filling the V-shaped groove with a copper foil; and setting simulation comparison before and after compensation, and detecting impedance continuity before andafter compensation. According to the invention, the V-shaped groove is added on the wiring layer so that the wiring impedance continuity is maintained in a manner of three-dimensionally compensatinga wiring width.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board design, and in particular relates to a compensation method for keeping impedance continuity at a wiring layer. Background technique [0002] In the design of printed circuit boards, chips in BGA packages are often used. When the pin pitch of the BGA chip is ≤0.5mm, the line width of the outgoing pin line will change from thin to thick, resulting in discontinuous line impedance in the BGA area. In the existing technology, the only way to shorten the line to be compensated The length of the line width of the line makes the length of the impedance discontinuity as short as possible, and the impedance discontinuity cannot be completely avoided. Contents of the invention [0003] Aiming at the above-mentioned shortcomings of the prior art, the present invention provides a compensation method for keeping the impedance continuity of the trace layer, so as to solve the above-mentioned tec...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/025H05K3/0002H05K3/0005H05K2201/0784
Inventor 毛晓彤
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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