Compensation method for keeping impedance continuity of wiring layer
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
- Publication Date
- 2021-01-29
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of printed circuit board design, and in particular relates to a compensation method for keeping impedance continuity at a wiring layer. Background technique
[0002] In the design of printed circuit boards, chips in BGA packages are often used. When the pin pitch of the BGA chip is ≤0.5mm, the line width of the outgoing pin line will change from thin to thick, resulting in discontinuous line impedance in the BGA area. In the existing technology, the only way to shorten the line to be compensated The length of the line width of the line makes the length of the impedance discontinuity as short as possible, and the impedance discontinuity cannot be completely avoided. Contents of the invention
[0003] Aiming at the above-mentioned shortcomings of the prior art, the present invention provides a compensation method for keeping the impedance continuity of the trace layer, so as to solve the above-mentioned tec...