Environment-friendly flame-retardant insulating material

Abstract

The invention discloses an environment-friendly flame-retardant insulating material. The material comprises the following raw materials in parts by weight: 25-40 parts of polyethylene, 20-40 parts ofan ethylene-vinyl acetate copolymer, 10-20 parts of graphene, 13-18 parts of magnesium hydroxide, 10-15 parts of polypropylene reinforced fibers, 10-15 parts of aromatic polyamide fibers, 12-19 partsof aluminum oxide, 5-7 parts of polyamide, 10-15 parts of calcium silicate, 2-7 parts of a plasticizer, 0.5-3.0 parts of an accelerant, 10-20 parts of a flame retardant, 1-5 parts of an antioxidant, 2-5 parts of a lubricant, 2-3 parts of a compatilizer, 3-7 parts of a toughening compatibilizer, wherein the outer side of each of the toughening compatibilizer and the graphene is coated with an insulating coating layer. According to the environment-friendly flame-retardant insulating material disclosed by the invention, the compatibility among the components is improved through the ethylene-vinylacetate copolymer and the maleic anhydride graft, so that the breaking strength and the elongation of the environment-friendly flame-retardant insulating material are improved; and the environment-friendly insulating material provided by the invention is long in service life, improves the use safety, adopts halogen-free environment-friendly raw materials, does not generate toxic gas during incineration, does not pollute a human body and the environment, and is green and environment-friendly.

Description

technical field

[0001] The invention belongs to the technical field of insulating materials, and in particular relates to an environment-friendly flame-retardant insulating material. Background technique

[0002] With the rapid development of the current information industry, electronic products are showing the development trend of lightness, miniaturization, digitalization, multi-function and networking. Various new electronic materials are urgently needed to meet the design and manufacturing requirements of electronic components. However, electronic devices often have high power, severe heat generation, and more compact integrated design requirements. Therefore, the heat dissipation problem of electronic materials used for substrates, packages, copper-clad substrates, and thermally conductive adhesives has become an important field in today's electronics manufacturing industry. One of the key issues in this field is the need to develop high thermal conductivity materials s...