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Welding medium carrying equipment

A medium and equipment technology, applied in the field of welding medium carrying equipment, can solve problems such as low degree of automation, and achieve the effect of avoiding production capacity loss

Active Publication Date: 2022-06-07
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing welding medium bearing equipment has a low degree of automation and needs to be further improved

Method used

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  • Welding medium carrying equipment
  • Welding medium carrying equipment
  • Welding medium carrying equipment

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Experimental program
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Embodiment Construction

[0016] Please also refer to figure 1 and figure 2 , figure 1 It is a schematic diagram of the cross-sectional structure of the upper chip 1 in the production process of component stacking assembly, figure 2 Yes figure 1 A schematic top view of the middle and upper layer chip 1 , an array of solder pins 2 is distributed on one side surface of the upper layer chip 1 , for example, the solder pins 2 may be spherical solder pins 2 . During the mounting production process of component stacking assembly, first mount the lower chip on the printed circuit board, and then suck the upper chip 1 and move it to the top of the soldering medium carrier device, so that the solder pin 2 of the upper layer chip 1 dips into the soldering medium carrier device. Finally, the upper-layer chip 1 dipped with the soldering medium is mounted on the lower-layer chip, and soldered by reflow soldering.

[0017] In the long-term production practice, the inventor found that during the mounting produc...

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PUM

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Abstract

The application provides a welding medium bearing device, including a sliding platform, a bearing tank, a scraper and a distance measuring component, the bearing tank is rotatably fixed on the sliding platform, and is used to accommodate the welding medium; the scraper is fixed Set on the sliding platform and adjacent to the bearing tank, the scraper is used to scrape the surface of the welding medium in the bearing tank; the distance measuring component is used to automatically monitor the welding in the bearing tank The height of the medium. The welding medium bearing equipment provided by the present application has a high degree of automation.

Description

technical field [0001] The present application relates to the technical field of chip packaging, and in particular, to a soldering medium carrying device. Background technique [0002] In the design and production of electronic products, in order to improve the flexibility and expansibility of product assembly, component stacking assembly is widely used in design. Before the placement production of the component stacking assembly, the soldering medium carrier equipment needs to be fixedly installed in the placement machine. During the mounting production process of component stacking assembly, the lower layer chip is first mounted on the printed circuit board, and then the upper layer chip is sucked and moved to the top of the soldering medium carrier equipment, so that the solder feet of the upper layer chip dip into the soldering medium carrier equipment. Finally, the upper-layer chip dipped in the soldering medium is mounted on the lower-layer chip, and soldered by reflo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K13/04H05K13/08
CPCH05K3/3457H05K3/3494H05K13/0465H05K13/0817H05K13/082H05K2203/163
Inventor 丘奕东
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD