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Image sensor and camera module using same

An image sensor and image processor technology, applied in image communication, image data processing, graphics and image conversion, etc., can solve the problems of increased camera module size and manufacturing cost, difficulty in obtaining depth resolution of moving objects, and insufficient information. Achieve the effect of reducing signal processing time, high resolution, and shortening signal transmission time

Active Publication Date: 2021-02-02
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using IR structured light, the problem is that it is difficult to obtain the desired level of depth resolution for moving objects
[0006] However, in the case of the current ToF method, there is a problem that the information that can be obtained from one frame is insufficient, i.e. its resolution is very low
However, in this case, there is a problem in that the size and manufacturing cost of the camera module are significantly increased

Method used

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  • Image sensor and camera module using same
  • Image sensor and camera module using same
  • Image sensor and camera module using same

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Embodiment Construction

[0039] Since the invention allows for various changes and many embodiments, specific embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that all changes, equivalents and substitutions that do not depart from the spirit and technical scope of the present invention are included in the present invention.

[0040] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish elements. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present invention. The term "and / or" includes a combination or any one of a plurality of the associated listed items.

[0...

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Abstract

An image sensor according to an embodiment of the present invention includes: a pixel array in which a plurality of pixels are arrayed in a grid shape, and which converts reflection light signals reflected from an object into electrical signals; an image processor which converts the electrical signals to generate subframes, and extracts pieces of second depth information having a higher resolutionthan pieces of first depth information extracted from a plurality of the subframes; and a memory for storing the pieces of first depth information, wherein the reflection light signals are input to the pixel array through mutually different optical paths shifted in sub-pixel units of the pixel array, and the memory stores a plurality of the pieces of first depth information that correspond to themutually different optical paths.

Description

technical field [0001] The present invention relates to an image sensor and a camera module using the same. Background technique [0002] In addition to the field of games and culture, 3D content is applied to various fields such as education, manufacturing, autonomous driving, etc., and a depth map is necessary to obtain 3D content. A depth map is a map showing spatial distance, and shows viewing angle information of one point relative to another point in a two-dimensional image. [0003] One of the methods to obtain a depth map is to project infrared (IR) structured light onto an object, and interpret the light reflected from the object to extract the depth map. With IR structured light, there is a problem that it is difficult to obtain a desired level of depth resolution for moving objects. [0004] Meanwhile, as a technique to replace the IR structured light method, a time-of-flight (TOF) method is attracting attention. [0005] According to the TOF method, the time-o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N13/271H04N5/335G01S17/89
CPCG01S17/89H04N13/271G06T2200/08G06T3/4069H04N5/2226H04N23/55H04N25/00G01S17/894G06T3/4076H04N23/56
Inventor 张成河李雄李昌奕
Owner LG INNOTEK CO LTD