LED backlight module with large light emitting angle, and display device

A light-emitting angle and backlight module technology, applied in the TV field, can solve the problems of not conforming to the mainstream market design trend of thin and light machines, and the overall thickness of the LED backlight module increases, so as to improve the optical quality, reduce the amount of chips, and improve the cost performance. Effect

Pending Publication Date: 2021-02-05
江西兆驰光元科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide an LED backlight module and a backlight module with a large light emitting angle, so as to solve the problem that the light emitting angle of the light source of the existing LED backlight module is generally about 120°, which needs to be used with a lens, and the LED light emitting angl

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  • LED backlight module with large light emitting angle, and display device
  • LED backlight module with large light emitting angle, and display device
  • LED backlight module with large light emitting angle, and display device

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[0017]In order to make the objectives, technical solutions, and beneficial effects of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0018]In order to illustrate the technical solution of the present invention, specific embodiments are used for description below.

[0019]SeeFigure 1 to Figure 3, The LED backlight module with a large light-emitting angle provided in the first embodiment of the present invention includes a PCB substrate 1, a plurality of LED chips 2, a diffuser 3 and a encapsulating body 4. The surface of the PCB substrate 1 is provided with tin spots 5, The LED chip 2 is fixed on the tin spot 5 by die bonding; the top surface of the LED chip 2 is provided with a reflective layer structure 6 formed by injecti...

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Abstract

The invention relates to the technical field of televisions, and especially relates to an LED backlight module with a large light emitting angle, and a display device. Tin points are arranged on the surface of a PCB substrate, and an LED chip is fixed on the tin points in a die bonding manner; and the top surface of the LED chip is provided with a reflecting layer structure formed by injection molding through a mold, and the periphery and the upper part of the LED chip are wrapped in packaging colloid in a dispensing manner. The reflecting layer structure on the top surface of the LED chip issubjected to mold injection molding treatment, the periphery and the upper part of the LED chip are wrapped in the packaging colloid in the dispensing manner and are baked and molded, and a diffusionsheet is arranged above the LED chip, so that top light emission is effectively weakened, more light is emitted from the four side surfaces of the LED chip, and the light emission angle of the LED chip is larger. Therefore, according to the LED backlight module with the large light emitting angle, the light emitting angle of the LED chip is increased, and the optical quality is improved; and the use amount of chips is reduced, the cost performance is improved, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of televisions, in particular to an LED backlight module and a display device with a large light output angle. Background technique [0002] Most of the existing LED backlight module light sources are used in the field of TV backlight. At present, LED backlight modules usually use LED light sources with bowl-shaped SMD traditional lamp bead light sources. The light output angle is generally around 120°. It needs to be used with a lens to increase the light output angle. , so that a uniform display surface light source can be achieved under a certain LED chip pitch and light mixing distance OD; in addition, the light emitting angle of the LED chip is small, and under a specific LED chip pitch, the light mixing distance needs to be larger to meet good conditions. The micro-distance mixing effect means that the overall thickness of the LED backlight module will increase, which does not meet the current mainstre...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/58H01L33/60
CPCH01L25/0753H01L33/58H01L33/60
Inventor 周波何至年唐其勇朱弼章
Owner 江西兆驰光元科技股份有限公司
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