Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support

A technology of LED light bar and manufacturing method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of small light emitting angle and low light output efficiency, and achieve the effects of increased light output efficiency, good light transmission performance, and improved packaging efficiency

Inactive Publication Date: 2013-09-11
左洪波 +2
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of the existing LED lamps, such as small light emitting angle and low light output efficiency, the present invention provides a method for manufacturing LED light strips with sapphire as the chip support to improve the light output efficiency of the chip.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0015] combine figure 1 , In this embodiment, the LED lamp power is designed to be 3W, and three light bars are pre-installed in each lamp. The power of each chip is 0.05W, so each light bar needs to arrange 20 chips. According to the size of the chip and the chip and the reserved size at both ends, the length of the light bar needs to be 25mm. According to the required width of the light bar, make a sapphire wafer with an end face size of 25×50mm and a thickness of 0.2-2mm. The surface of the sapphire wafer is plated with an aluminum metal film layer, and etched to form a connecting circuit, the width of the aluminum conductor is 80 μm, and the thickness of the circuit is 60 μm. After dispensing, solid crystal, and welding processes, the chip is fixed on the sapphire wafer in the form of flip chip. The fluorescent powder and silica gel w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a manufacturing method for a light-emitting diode (LED) lamp strip using sapphire as a chip support. A surface finish sapphire chip is used to replace an insulation layer and a heat sink used in traditional LED chip package, and a surface film pasting method is used for replacing a traditional glue dispensing or glue filling package method. In the LED structure, the sapphire chip is used as a chip module support, an active layer can emit light rays towards all directions almost without loss, and luminous efficiency can be greatly improved. A glue film is manufactured by mixing fluorescent powder and heat conductive insulation paste, the production efficiency is high by coating the fluorescent powder in a film pasting method, the fluorescent powder can be ensured to be coated evenly, light color evenness is guaranteed, and light-emitting efficiency is improved.

Description

(1) Technical field [0001] The invention relates to the field of LED lighting, in particular to a method for manufacturing an LED light bar using transparent sapphire as a chip holder. (2) Background technology [0002] LED has the advantages of energy saving, environmental protection, and high efficiency, and is the most ideal substitute for traditional light sources. Although the luminous efficiency of the chip itself in LED lamps has a major impact on whether LED lamps can be popularized in the field of general lighting, only when the follow-up chip packaging structure can effectively dissipate heat, have high packaging efficiency and low cost, can LED lights enter the field of general lighting . [0003] The LED production process usually includes a series of processes such as cleaning PCB or LED bracket, glue preparation, crystal expansion, spiny crystal, curing, pressure welding, dispensing and packaging, and can be divided into Lamp-LED, TOP-LED, Side-LED according t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/58H01L33/02H01L33/44H01L33/64H01L33/48H01L33/00
Inventor 左洪波朱晓飚唐寅轩
Owner 左洪波
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap