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Heat dissipation device and reaction chamber for heating tube in reaction chamber

A heat dissipation device and heating tube technology, applied in the direction of chemically reactive gases, single crystal growth, chemical instruments and methods, etc., can solve the problems of gypsum seals that are prone to failure, and achieve the effect of preventing excessive temperature and failure

Active Publication Date: 2021-08-13
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The application discloses a cooling device and a reaction chamber for heating tubes in the reaction chamber, which can solve the problem that the plaster seal between the quartz tube and the lamp holder is more likely to fail due to the high temperature of the lamp holder

Method used

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  • Heat dissipation device and reaction chamber for heating tube in reaction chamber
  • Heat dissipation device and reaction chamber for heating tube in reaction chamber
  • Heat dissipation device and reaction chamber for heating tube in reaction chamber

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Embodiment Construction

[0026] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0027] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequ...

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Abstract

The present application discloses a heat dissipation device and a reaction chamber for a heating tube in a reaction chamber. In the disclosed heat dissipation device (100), the heat dissipation body (110) is used to be compatible with the base (210) of the heating tube (200). The connection is disassembled and connected by heat conduction. There is a fluid passage in the heat dissipation body (110). Both the fluid inflow part (120) and the fluid outflow part (130) are connected to the fluid passage. Above, the temperature measuring device (160) is arranged at the fixed connection between the cooling body (110) and the base (210), for measuring the temperature of the base (210), and the temperature measuring device (160) and the thermostat (150) ) is electrically connected to the input end, and the regulating valve (140) is electrically connected to the output end of the thermostat (150). The above solution can solve the problem that the gypsum seal between the quartz tube and the lamp holder is more likely to fail due to the high temperature of the lamp holder.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a heat dissipation device and a reaction chamber for heating tubes in a reaction chamber. Background technique [0002] Chemical vapor deposition epitaxial growth is to transport the reaction gas to the reaction chamber, and react it by heating, etc., and the growth atoms are deposited on the substrate to grow a single crystal layer. [0003] The reaction chamber passes through such as figure 1 The shown heating tube 10 is heated. The heating tube 10 includes a lamp holder 11, a filament 12 and a quartz tube 13. The filament 12 is located in the quartz tube 13, and the filament 12 is electrically connected to the lamp holder 11. The quartz tube 13 is connected to the lamp holder 11. The joints are sealed with plaster. Since the temperature in the reaction chamber usually needs to be between 1000°C and 1200°C, the heating tube 10 needs to output...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B25/10C30B25/16
CPCC30B25/10C30B25/16
Inventor 商家强
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD